Dr. Ryan L. Burns
Principal Research Scientist at Tokyo Electron America Inc
SPIE Involvement:
Author
Publications (7)

PROCEEDINGS ARTICLE | April 26, 2017
Proc. SPIE. 10147, Optical Microlithography XXX
KEYWORDS: Lithography, Logic, Optical lithography, Etching, Metals, Control systems, Computer simulations, Photomasks, Extreme ultraviolet, Semiconducting wafers, TCAD, Back end of line, Front end of line

PROCEEDINGS ARTICLE | April 2, 2008
Proc. SPIE. 6924, Optical Microlithography XXI
KEYWORDS: Wafer-level optics, Lithography, Data modeling, Calibration, Computer simulations, Scanning electron microscopy, Optical proximity correction, Semiconducting wafers, Performance modeling, Resolution enhancement technologies

PROCEEDINGS ARTICLE | March 21, 2006
Proc. SPIE. 6154, Optical Microlithography XIX
KEYWORDS: Neck, Lithography, Visualization, Inspection, Printing, Photomasks, Optical proximity correction, SRAF, Standards development, Defect inspection

PROCEEDINGS ARTICLE | May 20, 2004
Proc. SPIE. 5374, Emerging Lithographic Technologies VIII
KEYWORDS: Lithography, Optical lithography, Etching, Ultraviolet radiation, Molecules, Scanning electron microscopy, Monte Carlo methods, Finite element methods, Polymerization, Molecular interactions

PROCEEDINGS ARTICLE | May 14, 2004
Proc. SPIE. 5376, Advances in Resist Technology and Processing XXI
KEYWORDS: Lithography, Optical lithography, Photoresist materials, Extreme ultraviolet lithography, Critical dimension metrology, Line edge roughness, Photoresist processing, Semiconducting wafers, Photoresist developing, Standards development

PROCEEDINGS ARTICLE | May 14, 2004
Proc. SPIE. 5376, Advances in Resist Technology and Processing XXI
KEYWORDS: Lithography, Satellites, Polymers, Particles, Molecules, Adsorption, Photoresist processing, Semiconducting wafers, Photoresist developing, 193nm lithography

Showing 5 of 7 publications
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