The paper reports a capacitive multisection sensor for measuring level of various liquids. Presented sensor was fully fabricated with the inkjet printing technology on thin Kapton substrate. The measurement of liquids level based on capacitive sensing is already well known technique, however the novelty of presented sensor is the technology of fabrication that was used, approach to the pattern design which combines analog and digital capacitive section and obtained self-calibration feature of whole system independently on measured liquid type.
Fabricated sensor structure has dimension of 210 mm x 12 mm and the thickness approximately of 27 μm. It contains 8 digital-like sections along the sensor and one analog section which allows to fine measurements. The sensor was tested in a vessel during filling and emptying with various liquids. Performed tests exhibited the linearity of the sensor characteristic and the lack of hysteresis. Obtained sensitivity of the sensor prototype was approximately 6.8 pF/mm, but it could be easily modify on the design stage due to the fast prototyping feature of inkjet printing technology. Thanks to the flexibility of the substrate, the sensor structure can be applied to any shape of vessel. Furthermore, the sensor construction is fairly simple and costs in mass production could be extremely low. This type of sensor was design especially for autonomous cleaning and washing robots for large areas operation.
In this paper the application of the ink-jet printing technology to microstrip line fabrication on tunable ferroelectric
ceramic-polymer composites for devices operating at sub-terahertz range have been presented. Measurement results
shown that the designed material is usable for creating structures able to tune some their electromagnetic characteristics.
Relatively low temperature technology process (ink-jet printing technology) is able to deposit conductive lines on the
ceramic polymer. The ink-jet printed silver microstrip lines can operate at sub-terahertz range.
The paper briefly describes Bluetooth standard and authors’ Bluetoth sensors modules construction. At the beginning the short comparison of existing on the market standards of wireless data transmission (IEEE802.11, IEEE802.11b/g, IEEE802.11a, HomeRF, Bluetooth, Radiometrix, Motorola, IrDA) brought out by main firms is presented. Next selected Bluetooth features and functions useful to sensors wireless network creations are discussed. At the end our own Bluetooth sensor based on the newest Ericsson ROK 101 007 module is specified.
The simulation results of temperature distribution in the new type silicon dew point detector are presented in this paper. Calculations were done with use of the SMACEF simulation program. Fabricated structures, apart from the impedance detector used to the dew point detection, contained the resistive four terminal thermometer and two heaters. Two detector structures, the first one located on the silicon membrane and the second one placed on the bulk materials were compared in this paper.
Two new methods of sub-cooled water recognition in dew point hygrometers are presented in this paper. The first one- impedance method use a new semiconductor mirror in which the dew point detector, the thermometer and the heaters were integrated all together. The second one an optical method based on a multi-section optical detector is discussed in the report. Experimental results of both methods are shown. New types of dew pont hydrometers of ability to recognized sub-cooled water were proposed.
A non-contact passive inductive interface to any type of capacitive sensor structure is presented in the paper. The interface performance is based on the magnetic coupling between two planar coils where one is located on the sensor die and the other is the pat of measurement circuit. The interface construction ins very simple in fabrication and reliable in operation. The theoretical calculations, metrological parameters analysis as well as a sensitivity on the interface parameters variation are discussed in the report.
The construction of both the backside contacts and the package for replaceable sensor structure bonding has been described in the paper. Some aspects of technological process for backside contact performance are discussed in the report too. The measurement results from the structure test proved small and stable contact resistance when sensor structures have been changed in the package more than 100 times. A new method of changeable package has been shown.