Prof. S.V. Sreenivasan
Professor at Univ of Texas at Austin
SPIE Involvement:
Author | Instructor
Publications (57)

Proceedings Article | 13 June 2022 Poster
Akhila Mallavarapu, Mark Hrdy, Mariana Castaneda, Paras Ajay, S.V. Sreenivasan
Proceedings Volume PC12056, PC120560C (2022)
KEYWORDS: Etching, Silicon, Metals, Nanostructures, Wet etching, Plasma etching, Optical lithography, Transistors, Sensors, Semiconductors

Proceedings Article | 26 May 2022 Poster + Paper
Proceedings Volume 12053, 1205327 (2022)
KEYWORDS: Scanning electron microscopy, Image segmentation, Artificial intelligence, Image processing, Process engineering, Image analysis, Wet etching, Semiconductors, Neural networks, Metals

Proceedings Article | 22 February 2021 Presentation + Paper
Juan Faria-Briceno, Vineeth Sasidharan, Alexander Neumann, Shrawan Singhal, S. V. Sreenivasan, S. R. Brueck
Proceedings Volume 11610, 116100F (2021)

Proceedings Article | 16 October 2017 Paper
Niyaz Khusnatdinov, Douglas Resnick, Shrawan Singhal, Michelle Grigas, S. V. Sreenivasan
Proceedings Volume 10451, 104511A (2017)
KEYWORDS: Semiconducting wafers, Nanoimprint lithography, Photomasks, Optical lithography, Chemical mechanical planarization, Lithography, Manufacturing, Ultraviolet radiation

Proceedings Article | 25 May 2017 Presentation
Shrawan Singhal, Michelle Grigas, Niyaz Khusnatdinov, Srinivasan Sreenivasan
Proceedings Volume 10146, 1014619 (2017)
KEYWORDS: Semiconducting wafers, Glasses, Chemical mechanical planarization, Surface finishing, Polishing, Etching, Wafer-level optics, Optical lithography, Lithography, Ultraviolet radiation

Showing 5 of 57 publications
Course Instructor
SC622: Nano-Scale Patterning with Imprint Lithography
This course will start by discussing the basics of nanoimprint lithography including a discussion of the various kinds of imprint lithography. It will cover advantages and challenges of using imprint lithography for sub-100 nm and sub-50 nm patterning. The course will focus on step and repeat UV nanoimprint lithography tools and processes. Specific topics addressed will include: tool design and performance, process resolution limits, CD control, etch requirements, overlay alignment, process defects, materials development, and 1X mask infrastructure. Potential applications of the technology will also be discussed.
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