Prof. S. V. Sreenivasan
Professor at Univ of Texas at Austin
SPIE Involvement:
Author | Instructor
Publications (54)

Proceedings Article | 16 October 2017 Paper
Proc. SPIE. 10451, Photomask Technology 2017
KEYWORDS: Lithography, Optical lithography, Ultraviolet radiation, Manufacturing, Photomasks, Nanoimprint lithography, Semiconducting wafers, Chemical mechanical planarization

Proceedings Article | 25 May 2017 Presentation
Proc. SPIE. 10146, Advances in Patterning Materials and Processes XXXIV
KEYWORDS: Wafer-level optics, Lithography, Polishing, Optical lithography, Etching, Glasses, Ultraviolet radiation, Semiconducting wafers, Surface finishing, Chemical mechanical planarization

Proceedings Article | 23 October 2015 Paper
Proc. SPIE. 9635, Photomask Technology 2015
KEYWORDS: Semiconductors, Nanotechnology, Lithography, Particles, Control systems, Photomasks, Semiconductor manufacturing, Nanoimprint lithography, Semiconducting wafers, Overlay metrology

Proceedings Article | 19 March 2015 Paper
Proc. SPIE. 9423, Alternative Lithographic Technologies VII
KEYWORDS: Semiconductors, Lithography, Ultraviolet radiation, Particles, Photomasks, Semiconductor manufacturing, High volume manufacturing, Nanoimprint lithography, Semiconducting wafers, Overlay metrology

Proceedings Article | 19 March 2015 Paper
Proc. SPIE. 9424, Metrology, Inspection, and Process Control for Microlithography XXIX
KEYWORDS: Metrology, Silica, Polarization, Reflection, Etching, Polarizers, Scanning electron microscopy, Scatterometry, Aluminum, Scatter measurement

Showing 5 of 54 publications
Course Instructor
SC622: Nano-Scale Patterning with Imprint Lithography
This course will start by discussing the basics of nanoimprint lithography including a discussion of the various kinds of imprint lithography. It will cover advantages and challenges of using imprint lithography for sub-100 nm and sub-50 nm patterning. The course will focus on step and repeat UV nanoimprint lithography tools and processes. Specific topics addressed will include: tool design and performance, process resolution limits, CD control, etch requirements, overlay alignment, process defects, materials development, and 1X mask infrastructure. Potential applications of the technology will also be discussed.
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