Dr. Sean G. Reidy
Sr. Manager Technology & Integration at GLOBALFOUNDRIES Inc
SPIE Involvement:
Author
Publications (2)

PROCEEDINGS ARTICLE | March 13, 2018
Proc. SPIE. 10586, Advances in Patterning Materials and Processes XXXV
KEYWORDS: Packaging, Modulation, Metals, Copper, Silicon, Reliability, 3D modeling, Finite element methods, Semiconducting wafers, Back end of line

PROCEEDINGS ARTICLE | March 28, 2017
Proc. SPIE. 10145, Metrology, Inspection, and Process Control for Microlithography XXXI
KEYWORDS: Semiconductors, Lithography, Optical lithography, Metals, Image processing, Reliability, Resistance, Process control, Photomasks, Semiconductor manufacturing, Overlay metrology, Back end of line

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