Dr. Sébastien Barnola
Head of Plasma Etching & Stripping Laboratory at CEA-LETI
SPIE Involvement:
Author
Publications (20)

PROCEEDINGS ARTICLE | April 10, 2017
Proc. SPIE. 10149, Advanced Etch Technology for Nanopatterning VI
KEYWORDS: Lithography, Electron beam lithography, Etching, Line width roughness, Directed self assembly, Nanoimprint lithography, Critical dimension metrology, Photoresist processing, Semiconducting wafers, System on a chip

PROCEEDINGS ARTICLE | March 23, 2016
Proc. SPIE. 9782, Advanced Etch Technology for Nanopatterning V
KEYWORDS: Silica, Ions, Oxygen, Semiconductor lasers, Optoelectronics, Plasma etching, Photonic integrated circuits, Silicon photonics, Neodymium, Semiconducting wafers, Anisotropic etching

PROCEEDINGS ARTICLE | March 23, 2016
Proc. SPIE. 9782, Advanced Etch Technology for Nanopatterning V
KEYWORDS: Polymethylmethacrylate, Etching, Chemistry, Xenon, Directed self assembly, Plasma etching, Picosecond phenomena, Semiconducting wafers, Carbon monoxide, Plasma

PROCEEDINGS ARTICLE | March 19, 2015
Proc. SPIE. 9423, Alternative Lithographic Technologies VII
KEYWORDS: Lithography, Optical lithography, Polymethylmethacrylate, Etching, Image processing, Error analysis, Directed self assembly, Picosecond phenomena, Line edge roughness, Semiconducting wafers

PROCEEDINGS ARTICLE | March 18, 2015
Proc. SPIE. 9426, Optical Microlithography XXVIII
KEYWORDS: Lithography, Optical lithography, Deep ultraviolet, Waveguides, Etching, Silicon, Photoresist materials, Wave propagation, Silicon photonics, 193nm lithography

PROCEEDINGS ARTICLE | March 17, 2015
Proc. SPIE. 9428, Advanced Etch Technology for Nanopatterning IV
KEYWORDS: Etching, Silicon, Oxygen, Line width roughness, Plasma etching, Critical dimension metrology, Line edge roughness, Neodymium, Photoresist processing, Plasma

Showing 5 of 20 publications
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