Dr. Sharon N. Farrens
at EV Group Inc
SPIE Involvement:
Author
Publications (4)

PROCEEDINGS ARTICLE | December 29, 2005
Proc. SPIE. 6037, Device and Process Technologies for Microelectronics, MEMS, and Photonics IV
KEYWORDS: Microelectromechanical systems, Packaging, Oxides, Polymers, Glasses, Annealing, Silicon, Semiconducting wafers, Wafer bonding, Plasma

PROCEEDINGS ARTICLE | July 1, 2005
Proc. SPIE. 5836, Smart Sensors, Actuators, and MEMS II
KEYWORDS: Microelectromechanical systems, Polymers, Metals, Annealing, Ions, Silicon, Chemistry, Semiconducting wafers, Wafer bonding, Plasma

PROCEEDINGS ARTICLE | January 22, 2005
Proc. SPIE. 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
KEYWORDS: Microelectromechanical systems, Packaging, Polymers, Interfaces, Silicon, Coating, Optical alignment, Semiconducting wafers, Wafer bonding, Plasma

PROCEEDINGS ARTICLE | November 10, 2003
Proc. SPIE. 5177, Gradient Index, Miniature, and Diffractive Optical Systems III
KEYWORDS: Microelectromechanical systems, Optical components, Lithography, Silicon, Coating, Sapphire, Semiconducting wafers, Adhesives, Compound semiconductors, Wafer bonding

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