Shigeru Hasebe
at Toshiba Corp
SPIE Involvement:
Author
Publications (7)

PROCEEDINGS ARTICLE | May 20, 2006
Proc. SPIE. 6283, Photomask and Next-Generation Lithography Mask Technology XIII
KEYWORDS: Semiconductors, Lithography, Optical lithography, Manufacturing, Inspection, Photomasks, Semiconductor manufacturing, Neodymium, Personal protective equipment, Process engineering

PROCEEDINGS ARTICLE | August 28, 2003
Proc. SPIE. 5130, Photomask and Next-Generation Lithography Mask Technology X
KEYWORDS: Lithography, Reticles, Spatial frequencies, Error analysis, Electroluminescence, Monte Carlo methods, Photomasks, Line edge roughness, Semiconducting wafers, Phase shifts

PROCEEDINGS ARTICLE | August 28, 2003
Proc. SPIE. 5130, Photomask and Next-Generation Lithography Mask Technology X
KEYWORDS: Semiconductors, Lithography, Manufacturing, Solids, Photomasks, Semiconductor manufacturing, Critical dimension metrology, Semiconducting wafers, Tolerancing, 193nm lithography

PROCEEDINGS ARTICLE | December 27, 2002
Proc. SPIE. 4889, 22nd Annual BACUS Symposium on Photomask Technology
KEYWORDS: Semiconductors, Lithography, Error analysis, Manufacturing, Solids, Photomasks, Critical dimension metrology, Semiconducting wafers, Tolerancing, Yield improvement

PROCEEDINGS ARTICLE | August 1, 2002
Proc. SPIE. 4754, Photomask and Next-Generation Lithography Mask Technology IX
KEYWORDS: Semiconductors, Lithography, Error analysis, Manufacturing, Solids, Transmittance, Photomasks, Critical dimension metrology, Semiconducting wafers, Tolerancing

PROCEEDINGS ARTICLE | June 29, 1998
Proc. SPIE. 3334, Optical Microlithography XI
KEYWORDS: Fabrication, Lithography, Distance measurement, Photomasks, Semiconductor manufacturing, Logic devices, Optical proximity correction, Critical dimension metrology, Semiconducting wafers, Personal protective equipment

Showing 5 of 7 publications
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