Dr. Shih-Chia Scott Chang Profile

Dr. Shih-Chia Scott Chang

at Delphi Research Labs

SPIE Involvement:

Author

Proceedings Article | 22 January 2005 Paper

Fabrication options and operation principle for single-crystal silicon vibratory ring gyroscope

Shih-Chia Chang, Michael Putty

Proceedings Volume 5717, (2005) https://doi.org/10.1117/12.583593

KEYWORDS: Silicon, Semiconducting wafers, Etching, Gyroscopes, Boron, Diffusion, Crystals, Reactive ion etching, Glasses, Sensors

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Four different approaches for the construction of a single crystal silicon vibratory ring gyroscope were investigated. All of them require deep trench etching (DRIE)of silicon, anodic bonding of silicon structures to a glass wafer, and a dissolve silicon wafer process. In the first approach, regular single crystal silicon was used as the starting sensor structural material. Heavy boron diffused silicon (B⁺⁺Si) was formed followed by anodic bonding to the glass plate. The undoped silicon was then dissolved and the device structure was fabricated by deep trench etching of the B++Si. Due to the slow boron diffusion process, this approach severely limits the attainable thickness of the device structure. In the second approach, deep trench etching was carried out first followed by boron diffusion. In order to reduce RIE lag and boron diffusion time, the larger features were subdivided into smaller ones before DRIE process. We found that RIE lag still existed which had a detrimental effect on the sensor performance. In the third approach, silicon-on-insulator (SOI) wafer was used and the sensor structures were built in the Si-epi layer by DRIE. Because of the very slow etch rate of SiO₂ in the DRIE process, RIE lag can be avoided. However, the associated footing problem makes the device dimensional control difficult. In the fourth approach, a layer of epi-GeB⁺⁺Si on silicon wafer was used to build the sensor structures. The fabrication process was similar to that used in the third approach. Both RIE lag and footing problems were avoided. In the operation of the vibratory ring gyroscope, it is highly desirable of having the resonant frequencies around the ring to be isotropic. In this work, theoretical and experimental studies were conducted aiming at achieving the isotropy of the resonant frequency of the single crystal silicon ring, which has an orientation dependent modulus of elasticity. We found that for odd flexural vibration modes, the resonant frequencies of the ring were isotropic, whereas, for even modes they became anisotropic.

Proceedings Article | 30 August 1999 Paper

Mechanical properties of boron-doped single-crystal silicon microstructures

Michael Putty, Shih-Chia Chang

Proceedings Volume 3874, (1999) https://doi.org/10.1117/12.361222

KEYWORDS: Silicon, Crystals, Boron, Semiconducting wafers, Bridges, High aspect ratio silicon micromachining, Etching, Laser crystals, Plasma etching, Doping

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Proceedings Article | 5 September 1997 Paper

Growth and crystallinity of electroformed nickel structures

Shih-Chia Chang, John Edens

Proceedings Volume 3223, (1997) https://doi.org/10.1117/12.284470

KEYWORDS: Nickel, Crystals, X-rays, Plating, Photoresist materials, Ultraviolet radiation, Lithography, X-ray microscopy, Transmission electron microscopy, Gold

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Proceedings Article | 5 September 1997 Paper

Automotive applications for micromachining

Douglas Sparks, Shih-Chia Chang

Proceedings Volume 3223, (1997) https://doi.org/10.1117/12.284483

KEYWORDS: Micromachining, Silicon, Microelectromechanical systems, Sensors, Plasma etching, Wafer bonding, Integrated circuit packaging, Integrated circuit design, Integrated circuits, Packaging

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Proceedings Article | 19 September 1995 Paper

Characterization of electroformed nickel microstructures

Qian Shi, Shih-Chia Chang, Michael Putty, David Hicks

Proceedings Volume 2639, (1995) https://doi.org/10.1117/12.221293

KEYWORDS: Nickel, Temperature metrology, Bridges, Silicon, Plating, Seaborgium, Selenium, Mechanical sensors, Electrodes, Sensors

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SPIE Conference Volume | 5 September 1997

Micromachining and Microfabrication Process Technology III

SPIE Conference Volume | 23 September 1996

Micromachining and Microfabrication Process Technology II

Conference Committee Involvement (2)

Micromachining and Microfabrication Process Technology III

29 September 1997 | Austin, TX, United States

Micromachining and Microfabrication Process Technology II

14 October 1996 | Austin, TX, United States

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