In recent years, demand for high-density integration of semiconductor chips has steadily increased due to miniaturization and high-performance requirements of electronics including Smartphones and Tablet PCs. In addition to 3D integration using Through-Silicon Via (TSV) technology, 2.5D integration technology using silicon interposers has also become a hot topic. Canon has identified key challenges that must be solved for successful implementation of high-density integration technologies into mass production and to meet these challenges, Canon developed the FPA-5510iV i-line lithography tool (stepper) that is now in wide use at customer sites for their most challenging processes. In this paper, Canon will explain details of FPA-5510iV features that support high-density integration. Canon will also introduce additional challenges that must be solved to ensure the success of high-density integration technologies in mass production, as well as Canon efforts to solve the remaining challenges.
3D stacking technology using TSVs, as well as linewidth shrinking, is crucial for future progress in semiconductor
devices. A new i-line exposure tool, the FPA-5510iV, has been developed which provides the functions necessary for
implementing TSV processes. This paper reports on Canon's commitment to make advanced TSV processes a reality.
Development of a small Wolter type-I mirror that is mainly used as an objective for the X-ray microscope is described. Small Wolter mirrors for X-ray microscopes are fabricated by the vacuum replication method because of their long aspherical shape. Master mandrel is ground and polished by an ultra-precision NC lathe. Tungsten carbide was selected as a material because its thermal expansion coefficient is a little larger than the replica glass. It was ground by ELID (Electrolytic In-process Dressing) grinding technique that is appropriate for the efficient mirror surface grinding. After ultra-precision grinding, the figure error of master mandrel was better than 0.5μm except the boundary between the hyperboloid and the ellipsoid. Before vacuum replication, the mandrel was coated with Au (thickness 50nm) as the parting layer. Pyrex glass was empirically selected as mirror material. The master mandrel was inserted into the Pyrex glass tube and heated up to 675°C in the electric furnace. Although vacuum replication is a proper technique in terms of its high replication accuracy, the surface roughness characterized by the high spatial frequency of the mandrel was replicated less accurate than the figure error characterized by the low spatial frequency. This indicates that the surface roughness and the figure error depend on the glass surface and the figure error of the master mandrel, respectively. A fabricated mirror was evaluated by the imaging performance with a laser plasma X-ray source (λ=3.2nm).