We report the observation of sample behaviors using the confocal laser scanning microscopy (CLSM) in on-chip microcapillary. Sample loading by pinched valve injection is observed in a new cross injector shape, which has the structure added conventional cross injector to circle shape. In sample loading, because this structure causes a different electric field compared with that in conventional cross injector, high efficient sample plug injection was performed. It is important to investigate further the detailed sample profiles using the CLSM in sample loading for development of the on-chip microcapillary. We attempt the simulation of sample loading in the cross injector using the semiconductor device simulator MEDICI in order to investigate it in further detail. The sample movements in the channel turn along the Z-direction are observed using the CLSM. In order to miniaturize the microfluidic channel, it is necessarily needed to fold the channel, but then it is inevitable that sample dispersion occurs in the turn. We present sample flow profiles along the Z-direction in the turn using the CLSM and the influence on the electrophoretic separation. Also, we improve that fabrication of duct channel for exhaustion the vaporized xylene to outside the chip and the adhesion process
A very important aspect in the next stage of genomic research will be the study of genetic diversity originating from an individual, for example, a single nucleotide polymorphism (SNP),. For this, the base-pair sequence needs to be determined quickly and easily; along with effectively gathering the proteins that are produced from the cell and depend on each genetic design. To meet these demands, the use of a miniaturized experimental apparatus formed on a chip is suitable as it gives a very small and well-controlled space to undertake precise analyses. This type of chip device needs to be disposable, inexpensive and of uniform quality, therefore many chips should be fabricated at the same time from a low cost chip material such as plastic. A mass production fabrication process for such plastic chips was determined as follows. A thick coating type photoresist was spin-coated onto a 4-inch size Si wafer to 20 μm thickness and patterned by UV-lithography. Thick Au structures were embedded into the resist mold by microelectropolating. After removal of the resist, Au fine structures remained and were used as a metal mold for plastic casting. Plastic, polymethylmethacrylate (PMMA), beads were dissolved in acetone and the polymer solution was cast into the metal mold under vacuum heating environment producing many identical plastic chips at a thickness of 1 mm. The size of the chemical reaction channel, one of the device’s components, was 50 μm in width and 20 μm in depth.