Dr. Shmuel Ben Nissim
at Applied Materials Israel, Ltd.
SPIE Involvement:
Publications (4)

Proceedings Article | 27 April 2023 Presentation + Paper
G. Lorusso, A. Moussa, J. Bogdanowicz, B. Groven, P. Morin, A.-L. Charley, M. Saib, G. Santoro, Y. Abramovitz, K. Houtchens, S. Ben Nissim, N. Meir, J. Hung, A. Urbanowicz, R. Koret, I. Turovets, M. Beggiato
Proceedings Volume 12496, 124961X (2023) https://doi.org/10.1117/12.2657968
KEYWORDS: Semiconducting wafers, Scanning electron microscopy, Monolayers, Scatterometry, 2D materials, Metrology, Atomic force microscopy, Raman spectroscopy, Silicon, Histograms

SPIE Journal Paper | 4 November 2022
JM3, Vol. 21, Issue 04, 041605, (November 2022) https://doi.org/10.1117/12.10.1117/1.JMM.21.4.041605
KEYWORDS: Etching, System on a chip, Image processing, Sensors, Lithography, Semiconducting wafers, Distance measurement, Process control, Transistors, Signal to noise ratio

Proceedings Article | 13 June 2022 Presentation
Proceedings Volume PC12053, PC120530D (2022) https://doi.org/10.1117/12.2614221
KEYWORDS: Overlay metrology, Double patterning technology, Edge roughness, Scanning electron microscopy, Manufacturing, Line width roughness, Line edge roughness, Integrated circuits, Electron microscopy, Critical dimension metrology

Proceedings Article | 19 August 2021 Presentation + Paper
Alexander Vipolzov, Yu Zhang, Biqiu Liu, Cong Zhang, Yuyang Bian, Song Gao, Yifei Zhu, Xiaobo Guo, Jun Huang, Shmuel Ben Nissim, Omri Baum, Qiang Zhou, Yaniv Abramovitz, Uri Smolyan
Proceedings Volume 11611, 116111X (2021) https://doi.org/10.1117/12.2585391
KEYWORDS: Overlay metrology, Instrument modeling, Semiconducting wafers, Measurement devices, Wafer-level optics, Mathematical modeling, Yield improvement, Etching, Optical testing, Data modeling

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