In this paper, we report the design and fabrication of an uncooled infrared (IR) focal plane array (FPA) on quartz
substrate and the wafer-level vacuum packaging for the IR FPA in view of an optical readout method. This FPA is
composed of bi-material cantilever array which fabricated by the Micro-Electro Mechanical System (MEMS) technology,
and the wafer-level packaging of the IR FPA is realized based on AuSn solder bonding technique. The interface of
soldering is observed by scan electron microscope (SEM), which indicates that bonding interface is smooth and with no
bubbles. The air leakage rate of packaged FPA is measured to be 1.3×10<sup>-9</sup> atm·cc/s.