Prof. Srinivas A. Tadigadapa
Associate Professor at Northeastern Univ
SPIE Involvement:
Conference Chair | Conference Program Committee | Author
Publications (18)

Proceedings Article | 20 February 2008
Proc. SPIE. 6885, MEMS/MOEMS Components and Their Applications V. Special Focus Topics: Transducers at the Micro-Nano Interface
KEYWORDS: Microelectromechanical systems, Gold, Molecular bridges, Silica, Nickel, Photoresist materials, Bridges, Thermoelectric materials, Temperature metrology, Nanowires

Proceedings Article | 12 February 2007
Proc. SPIE. 6464, MEMS/MOEMS Components and Their Applications IV
KEYWORDS: Microelectromechanical systems, Gold, Microscopy, Silicon, Coating, Resistance, Bridges, Thermal modeling, Temperature metrology, Wheatstone bridges

Proceedings Article | 12 February 2007
Proc. SPIE. 6464, MEMS/MOEMS Components and Their Applications IV
KEYWORDS: Proteins, Resonators, Quartz, Electrodes, Molecules, Crystals, Bioalcohols, Adsorption, Self-assembled monolayers, Molecular self-assembly

Proceedings Article | 12 February 2007
Proc. SPIE. 6464, MEMS/MOEMS Components and Their Applications IV
KEYWORDS: Oxides, Microscopes, Graphene, Silicon, Resistance, Physics, Atomic force microscopy, Transmission electron microscopy, Raman spectroscopy, Raman scattering

Showing 5 of 18 publications
Conference Committee Involvement (9)
MEMS/MOEMS Components and Their Applications V Special Focus Topics: Transducers at the Micro-Nano Interface
21 January 2008 | San Jose, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI
23 January 2007 | San Jose, California, United States
MEMS/MOEMS Components and Their Applications IV Special Focus Topics: Transducers at the Micro-Nano Interface
22 January 2007 | San Jose, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V
25 January 2006 | San Jose, California, United States
MEMS/MOEMS Components and Their Applications III
23 January 2006 | San Jose, California, United States
Showing 5 of 9 Conference Committees
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