The advent of uncooled infrared, XGA (1024×768) focal plane arrays (FPAs) enables new applications for ground
vehicles and soldier equipment. A low-power digital imaging module, based on a 17μm-pitch FPA, has been developed
and packaged in a rugged housing for demonstration in a distributed aperture system. Cameras and the embedded
thermal imaging modules have been delivered during 2009 and the module will be commercially available in 2010. This
new capability can extend the performance of existing uncooled ground-based systems. Some background is presented.
The product is described and several applications are introduced.