Dr. Stéfan Landis
at CEA-LETI
SPIE Involvement:
Author
Publications (13)

PROCEEDINGS ARTICLE | March 22, 2018
Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII
KEYWORDS: Electron beam lithography, Electron beams, Metrology, Lenses, Time metrology, Distance measurement, Process control, Raster graphics, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10584, Novel Patterning Technologies 2018
KEYWORDS: Lithography, Electron beam lithography, Etching, Metals, Copper, Scanning electron microscopy, Optical alignment, Semiconducting wafers, System on a chip, Back end of line

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10584, Novel Patterning Technologies 2018
KEYWORDS: Electron beam lithography, Electron beams, Line width roughness, Optical alignment, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | April 27, 2017
Proc. SPIE. 10144, Emerging Patterning Technologies
KEYWORDS: Lithography, Electron beam lithography, FT-IR spectroscopy, Ions, Silicon, Microelectronics, Ion implantation, Integrated circuits, Wet etching, Ion beam lithography

PROCEEDINGS ARTICLE | March 21, 2017
Proc. SPIE. 10144, Emerging Patterning Technologies
KEYWORDS: Lithography, Metrology, Calibration, Etching, Silicon, Manufacturing, Scanning electron microscopy, High volume manufacturing, Nanoimprint lithography, Critical dimension metrology, Semiconducting wafers, Standards development

PROCEEDINGS ARTICLE | October 20, 2016
Proc. SPIE. 10032, 32nd European Mask and Lithography Conference
KEYWORDS: Metrology, Polymers, Ultraviolet radiation, Silicon, Manufacturing, Scanning electron microscopy, High volume manufacturing, Nanoimprint lithography, Critical dimension metrology, Semiconducting wafers

Showing 5 of 13 publications
SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Back to Top