The experimental results of a preliminary study on stress-strain behavior of Cu-13.3% Al- 4% Ni (by wt.) single crystal shape memory alloy grown along the  direction at high temperatures are given. An Instron testing machine with a high temperature environmental chamber has been used to study the quasi-static stress-strain response of 1.5 mm diameter Cu-Al-Ni single crystal wires at different ambient temperatures in the range 100 - 160°C. Local strain measurements using a highly sensitive extensometer are compared with overall strain measurements computed from the net displacements between grips. The effect of stress cycles on overall strain on full loading, after unloading and after heating in between stress cycles has been discussed.
Copper-Aluminum-Nickel (Cu-Al-Ni) single crystal shape memory alloy (SMA) wires show great potential in actuator applications due to their high stress-free transformation temperatures and superior mechanical stability compared to common Nickel-Titanium SMAs. In this paper, Cu-13.3%Al-4%Ni (wt %) single crystal wires with stress-free transformation temperatures in the range of 80° C to 120° C were subjected to stress cycling tests at ambient temperatures up to 100° C at low deformation rates. Stress/strain curves up to 9% and 3% strain in the range of the transformation temperatures point to the possibility of phase transformation by detwinning. However, the residual overall strain after unloading decreased significantly at 60° C for both 3% and 9% strains. Accumulation of plastic deformation was observed for subsequent cycles.