Mr. Steven Wu
at United Microelectronics Corp
SPIE Involvement:
Author
Publications (9)

PROCEEDINGS ARTICLE | March 4, 2010
Proc. SPIE. 7640, Optical Microlithography XXIII
KEYWORDS: Lithography, Multilayers, Etching, Metals, Reflectivity, Control systems, Line width roughness, Immersion lithography, Logic devices, Back end of line

PROCEEDINGS ARTICLE | April 10, 2009
Proc. SPIE. 7273, Advances in Resist Materials and Processing Technology XXVI
KEYWORDS: Lithography, Multilayers, Optical lithography, Etching, Metals, Reflectivity, Control systems, Line width roughness, Logic devices, Tin

PROCEEDINGS ARTICLE | April 1, 2009
Proc. SPIE. 7273, Advances in Resist Materials and Processing Technology XXVI
KEYWORDS: Lithography, Antireflective coatings, Ions, Silicon, Reflectivity, Scanning electron microscopy, Silicon films, Transmittance, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | April 15, 2008
Proc. SPIE. 6923, Advances in Resist Materials and Processing Technology XXV
KEYWORDS: Lithography, Image processing, Line width roughness, Immersion lithography, Lutetium, Critical dimension metrology, Line edge roughness, Semiconducting wafers, Standards development, 193nm lithography

PROCEEDINGS ARTICLE | March 31, 2008
Proc. SPIE. 6923, Advances in Resist Materials and Processing Technology XXV
KEYWORDS: Lithography, Electron beam lithography, Polymers, Water, Surface roughness, Surface properties, Immersion lithography, Thin film coatings, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | March 26, 2008
Proc. SPIE. 6923, Advances in Resist Materials and Processing Technology XXV
KEYWORDS: Logic, Optical lithography, Metals, Scanners, Copper, Photomasks, Optical alignment, Semiconducting wafers, Signal detection, Tin

Showing 5 of 9 publications
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