To wire-bond automatically, the IC lead positions on the CAD drawing and the corresponding
ones on the extracted substrate image should be pre-verified. This paper proposed an AOI approach
for IC lead index auto-verification which conquered the lead shape distortion, golden exposed,
shifting, rotation, and scaling difficulties of extracted substrate image. Experimentations revealed
that the proposed AOI approach can accurately verify the corresponding leads between a CAD
drawing and the extracted substrate image with high repeatability.
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