PROCEEDINGS ARTICLE | September 30, 2009
Proc. SPIE. 7488, Photomask Technology 2009
KEYWORDS: Wafer-level optics, Defect detection, Detection and tracking algorithms, Data modeling, Scanners, Inspection, Transform theory, Photomasks, Semiconducting wafers, Airborne remote sensing
Die-to-Model (D2M) inspection is an innovative approach to running inspection based on a mask design layout data. The
D2M concept takes inspection from the traditional domain of mask pattern to the preferred domain of the wafer aerial
image. To achieve this, D2M transforms the mask layout database into a resist plane aerial image, which in turn is
compared to the aerial image of the mask, captured by the inspection optics.
D2M detection algorithms work similarly to an Aerial D2D (die-to-die) inspection, but instead of comparing a die to
another die it is compared to the aerial image model. D2M is used whenever D2D inspection is not practical (e.g., single
die) or when a validation of mask conformity to design is needed, i.e., for printed pattern fidelity. D2M is of particular
importance for inspection of logic single die masks, where no simplifying assumption of pattern periodicity may be
done. The application can tailor the sensitivity to meet the needs at different locations, such as device area, scribe lines
and periphery.
In this paper we present first test results of the D2M mask inspection application at a mask shop. We describe the
methodology of using D2M, and review the practical aspects of the D2M mask inspection.
