Mr. Sunwook Jung Profile

Sunwook Jung

Principal Engineer at ASML

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Publications (9)

Proceedings Article | 20 March 2019 Presentation + Paper

Predictable etch model using machine learning

Youngchang Kim, Sunwook Jung, DooHwan Kwak, Vlad Liubich, Germain Fenger

Proceedings Volume 10961, 1096106 (2019) https://doi.org/10.1117/12.2515271

KEYWORDS: Etching, Optical proximity correction, Mahalanobis distance, Machine learning, Convolution, Statistical modeling, Metals, Calibration, Optical lithography, Lithography

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Proceedings Article | 28 March 2017 Paper

Interlayer verification methodology for multi-patterning processes

Sunwook Jung, Sejin Park, Jungmin Kim, Jinhee Kim, John Sturtevant

Proceedings Volume 10147, 101470J (2017) https://doi.org/10.1117/12.2258356

KEYWORDS: Error analysis, Optical lithography, Visualization, Extreme ultraviolet, Nanoimprint lithography, Tolerancing, Bridges, Process engineering, Visual process modeling, Computational lithography, Process modeling, Etching, Feature extraction, Instrument modeling, Calibration, Critical dimension metrology

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Proceedings Article | 28 March 2016 Paper

Multi-layer VEB modeling: capturing interlayer etch process effects for multi-patterning process

Lin Hu, Sunwook Jung, Jianliang Li, Young Kim, Yuval Bar, Granger Lobb, Jim Liang, Atsushi Ogino, John Sturtevant, Todd Bailey

Proceedings Volume 9780, 97800N (2016) https://doi.org/10.1117/12.2219237

KEYWORDS: Etching, Metals, Reactive ion etching, Cadmium, Optical proximity correction, Data modeling, Semiconducting wafers, 3D modeling, Back end of line, Image processing

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Proceedings Article | 17 March 2015 Paper

Finding practical phenomenological models that include both photoresist behavior and etch process effects

Sunwook Jung, Thuy Do, John Sturtevant

Proceedings Volume 9428, 94280I (2015) https://doi.org/10.1117/12.2087096

KEYWORDS: Etching, 3D modeling, Photoresist materials, Critical dimension metrology, Optical proximity correction, Calibration, 3D image processing, Semiconductors, Lithography, Tolerancing

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Proceedings Article | 13 March 2012 Paper

Full-chip correction of implant layer accounting for underlying topography

Minchul Oh, Hyungjoo Youn, Noyoung Chung, Jaeyeol Maeng, Sukjoo Lee, Jahum Ku, Aasutosh Dave, John Sturtevant, Uwe Hollerbach, Thuy Do, Yuri Granik, Kostas Adam, Juhwan Kim, Cynthia Zhu, S. W. Jung

Proceedings Volume 8326, 83262R (2012) https://doi.org/10.1117/12.917984

KEYWORDS: Photomasks, Optical proximity correction, Oxides, Critical dimension metrology, Semiconducting wafers, Reflectivity, Calibration, Data modeling, Model-based design, Photoresist materials

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Proceedings Article | 29 March 2011 Paper

Application of mask process correction (MPC) to monitor and correct mask process drift

Timothy Lin, Tom Donnelly, Gordon Russell, Sunwook Jung, Jiyoung Jeong

Proceedings Volume 7971, 797107 (2011) https://doi.org/10.1117/12.879119

KEYWORDS: Data modeling, Calibration, Photomasks, Critical dimension metrology, Process modeling, Manufacturing, Process control, Target detection, Feedback loops, Error analysis

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Proceedings Article | 27 March 2007 Paper

Analysis of pattern density on process proximity compensation

Sunwook Jung, Fred Lo, Tien-Chu Yang, Ta-Hong Yang, Kuang-Chao Chen, Chih-Yuan Lu

Proceedings Volume 6520, 652046 (2007) https://doi.org/10.1117/12.711841

KEYWORDS: Etching, Critical dimension metrology, Laser phosphor displays, Semiconducting wafers, Optical proximity correction, Photomasks, Wafer-level optics, Model-based design, Lithography, Process control

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Proceedings Article | 26 March 2007 Paper

Intensity weighed focus drilling exposure for maximizing process window of sub-100-nm contact by simulation

Sunwook Jung, Tien-Chu Yang, Ta-Hung Yang, Kuang-Chao Chen, Chih-Yuan Lu

Proceedings Volume 6520, 65202C (2007) https://doi.org/10.1117/12.707537

KEYWORDS: Electroluminescence, Finite element methods, Semiconducting wafers, Image processing, Composites, Resolution enhancement technologies, Scanners, Francium, Image enhancement, Photoresist processing

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Proceedings Article | 15 March 2006 Paper

Multiple focal plane exposure in 248nm lithography to improve the process latitude of 110nm contact

Sunwook Jung, Elvis Yang, T. H. Yang, K. C. Chen, Joseph Ku, Chih-Yuan Lu

Proceedings Volume 6154, 61542F (2006) https://doi.org/10.1117/12.649716

KEYWORDS: Image processing, Resolution enhancement technologies, Semiconducting wafers, Lithography, Finite element methods, Photomasks, Image enhancement, Manufacturing, Critical dimension metrology, Printing

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Showing 5 of 9 publications

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