A high-fill factor/high-SNR CMOS readout integrated circuit (ROIC) array is designed for high dynamic range infrared
imaging systems. The designed ROIC array uses a single reference photodiode that is routed to each unit cell in the array
to subtract the dark current for high SNR and high fill factor. The achieved average SNR is 80 dB and the fill factor is
28% with a 25 x 25 μm<sup>2</sup> unit cell size. With this new unit cell and routing approach, the size of the unit cell is reduced by
300% compared to other high SNR circuits. The maximum power consumption per unit pixel is 500nW.
In this paper, a compact and low-cost electronic circuit system is designed to time reverse short impulses in microwave
regime. The proposed system consists of three major parts: (i) Fourier transform, to obtain discrete spectra of input
impulses; (ii) Digital signal processing, to digitize spectral samples resulted from the first part and process them; and
finally (iii) Inverse Fourier transform, to synthesize time-reversed impulses using discrete continuous wave elements.
This architecture is composed of commercially available semi-conductor components, including oscillators,
multipliers/mixers, band-pass-filters, amplifiers, and switches. Thus, it can embody a system-on-chip implementation of
real-time time-reversal. Its performance is demonstrated by Advanced Design System simulations, with time-reversal of
impulses with around 1.4 ns temporal width and [22, 29] GHz spectral coverage in noisy environments as examples.
Smart photonics, the integration of optoelectronic devices with electronic circuits and systems, has growing applications in many fields, one of which is computing. An exploration of the opportunities, integration technologies, and some recent results using thin film optoelectronic and electronic device integration with Si CMOS VLSI and GaAs MESFET technologies are presented herein. Applications explored herein include low cost alignment tolerant optoelectronic interconnection links for network inerconnections, smart focal plane array processing through the integration of imaging arrays with sigma delta analog to digital converters underneath each pixel, and three dimensional computational systems using vertical through-Si optical interconnections.
This paper presents the results of simultaneously working fully-differential optoelectronic receiver fabricated in Si CMOS with digital SIMD microprocessor on the same die next to analog, optical interface circuitry, the receiver have been hybrid integrated with a thin film InP-based inverted (I)-MSM photodetector and optically tested using external light source modulated by digital input signal. The noise immunity to mixed-signal digital switching noise of the differential receiver has been shown to be good enough to generate 10<SUP>-9</SUP> BER.