With the increase of litho-etch steps the industry requires metrology to deliver solutions to improve throughput of overlay measurements without impacting accuracy. ASML’s YieldStar 350E is capable of utilizing targets, which can measure the overlay of multiple layers simultaneously. For the work discussed in this paper, an evaluation is performed on Logic product wafers using both single-layer and multi-layer (MLT) quad type targets (able to capture up to four litho-etch steps). Different target types were compared in terms of Move-and-Acquire (MA) time, residual and matching to SEM. Using the MLT targets, an MA time improvement of 56% was demonstrated on the singlelayer. The maximum delta between the overlay residual among the YieldStar targets after applying an high order model was shown to be 0.05 nm. In comparison to after-etch overlay, the correlation of the MLT target was determined with an R<sup>2</sup> >; 0.95 using a set-get wafer with induced 10 nm overlay range. On a normal production wafer, the correlation was R<sup>2</sup> > 0.67, which is high on a wafer without induced overlay. The comparison of modeling parameters between SEM and MLT targets shows a good match (< 0.16nm) as well.
One of the most prospective alternative lithography ways prior to EUV implementation is the reverse imaging by means of a negative tone development (NTD) process with solvent-based developer. Contact and trench patterns can be printed in CAR (Chemically amplified resist) using a bright field mask through NTD development, and can give much better image contrast (NILS) than PTD process. Not only for contact or trench masks, but also pattering of IIP (Ion Implantation) layers whose mask opening ratio is less than 20% may get the benefit of NTD process, not only in the point of aerial imaging, but also in achievement of vertical resist profile, especially for post gate layers which have complex sub_topologies and nitride substrate. In this paper, we present applications for the NTD technique to IIP (Ion Implantation) layer lithography patterning, via KrF exposure, comparing the performance to that of the PTD process. Especially, to extend 248nm IIP litho to sub-20nm logic device, optimization of negative tone imaging (NTI) with KrF exposure is the main focus in this paper. With the special resin system designed for KrF NTD process, even sub 100nm half-pitch trench pattern can be defined with enough process margin and vertical resist profiles can be also obtained on the nitride substrate with KrF exposure.