Tai Yong Teo
at Nanyang Technological Univ
SPIE Involvement:
Author
Publications (1)

PROCEEDINGS ARTICLE | July 15, 2003
Proc. SPIE. 5041, Process and Materials Characterization and Diagnostics in IC Manufacturing
KEYWORDS: Polishing, Copper, Particles, Chemical mechanical planarization, Abrasives, Semiconducting wafers, Scanning electron microscopy, Metals, Surface finishing, Silica

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