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Takeshi Nogami
Senior Manager at Sony Electronics Inc
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Publications (2)
Proceedings Article | 17 November 2005 Paper
Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes
T. Nogami, S. Lane, M. Fukasawa, K. Ida, M. Angyal, K. Chanda, F. Chen, C. Christiansen, S. Cohen, M. Cullinan, C. Dziobkowski, J. Fitzsimmons, P. Flaitz, A. Grill, J. Gill, K. Inoue, N. Klymko, K. Kumar, C. Labelle, M. Lane, B. Li, E. Liniger, A. Madon, K. Malone, J. Martin, V. McGahay, P. McLaughlin, I. Melville, M. Minami, S. Molis, S. Nguyen, C. Penny, D. Restaino, A. Sakamoto, M. Sankar, M. Sherwood, E. Simonyi, Y. Shimooka, L. Tai, J. Widodo, H. Wildman, M. Ono, D. McHerron, H. Nye, C. Davis, S. Sankaran, D. Edelstein, T. Ivers
Proceedings Volume 6002, 60020L (2005) https://doi.org/10.1117/12.633066
KEYWORDS: Chemical mechanical planarization, Plasma, Back end of line, Photomasks, Manufacturing, Copper, Plasma enhanced chemical vapor deposition, Etching, Capacitance, Reliability
Proceedings Article | 4 September 1998 Paper
IMP Ta/Cu seed layer technology for high-aspect-ratio via fill by electroplating, and its application to multilevel single-damascene copper interconnects
Imran Hashim, Vikram Pavate, Peijun Ding, Barry Chin, Dirk Brown, Takeshi Nogami
Proceedings Volume 3508, (1998) https://doi.org/10.1117/12.324046
KEYWORDS: Copper, Electroplating, Plasma, Argon, Diffusion, Dielectrics, Metals, Tantalum, Chemical species, Ions
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