For applications such as computers, cellular telephones and Microsystems, it is essential to reduce the size and the
weight of DC-DC converters. To miniaturize passive components, micromachining techniques provide solutions based
on low-temperature process compatible with active part of the converter. This paper deals with the integration on silicon
of "spiral-type" inductor topology. Electroplating techniques are used to achieve the copper conductor and the CoNiFe
laminated magnetic core and several investigations on the electroplating bath's parameters have been realized in order to
obtain the adequate magnetic properties. Finally, a 1μH micro-inductor prototype has been characterized.