Mr. Tetsu Kawasaki
at Tokyo Electron AT Ltd
SPIE Involvement:
Author
Publications (16)

PROCEEDINGS ARTICLE | March 30, 2010
Proc. SPIE. 7639, Advances in Resist Materials and Processing Technology XXVII
KEYWORDS: Lithography, Etching, Image processing, Coating, Image analysis, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography, Critical dimension metrology, Photoresist processing

PROCEEDINGS ARTICLE | December 11, 2009
Proc. SPIE. 7520, Lithography Asia 2009
KEYWORDS: Lithography, Optical lithography, Silica, Etching, Photoresist materials, Atomic layer deposition, Line width roughness, Double patterning technology, Photoresist processing, Resolution enhancement technologies

PROCEEDINGS ARTICLE | April 1, 2009
Proc. SPIE. 7273, Advances in Resist Materials and Processing Technology XXVI
KEYWORDS: Lithography, Optical lithography, Etching, Photoresist materials, Line width roughness, Extreme ultraviolet lithography, Double patterning technology, Immersion lithography, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | April 1, 2009
Proc. SPIE. 7273, Advances in Resist Materials and Processing Technology XXVI
KEYWORDS: Semiconductors, Lithography, Silica, Etching, Reflectivity, Chemical vapor deposition, Double patterning technology, Semiconducting wafers, 193nm lithography, Tin

PROCEEDINGS ARTICLE | April 1, 2009
Proc. SPIE. 7273, Advances in Resist Materials and Processing Technology XXVI
KEYWORDS: Lithography, Optical lithography, Silica, Etching, Scanners, Chemical vapor deposition, Photomasks, Line width roughness, Double patterning technology, Overlay metrology

PROCEEDINGS ARTICLE | April 15, 2008
Proc. SPIE. 6923, Advances in Resist Materials and Processing Technology XXV
KEYWORDS: Semiconductors, Lithography, Optical lithography, Resistance, Extreme ultraviolet, Double patterning technology, Immersion lithography, Photoresist processing, Thin film deposition, 193nm lithography

Showing 5 of 16 publications
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