After thirty years of production of thermal imagers of the first and second generation, all designed on the same basic architecture, the evolution of the detectors technology to starring array has given birth to the ultimate generation of thermal imagers with no scanning mechanism. In the 3-5 micrometers and 8-12 micrometers wavebands, the performances and the size of starring array are adequate to design a new generation of products which will allow the use of FLIR almost everywhere in the forces. Smaller, lighter, cost effective, for better performance are the main characteristics of the third generation FLIR. The interest of starring array in IR has been known since a long time. But for the last twenty years, IR starring arrays (difficult to produce) were used for very specific applications and costly programs. The evolution of silicon technology leads the technology of IR detectors towards producibility, low cost, availability, in parallel the tremendous increase of computation power of DSP will allow the implementation of software to obtain a good image.