Tobias Waber
at Hochschule für Angewandte Wissenschaften München
SPIE Involvement:
Author
Publications (1)

PROCEEDINGS ARTICLE | May 17, 2013
Proc. SPIE. 8763, Smart Sensors, Actuators, and MEMS VI
KEYWORDS: Microelectromechanical systems, Packaging, Sensors, Copper, Ceramics, Aluminum, Adhesives, Sensor technology, Standards development, Temperature metrology

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