Dr. Todd E. Sessler Profile

Dr. Todd E. Sessler

at RTX Corp

SPIE Involvement:

Author

Publications (9)

Proceedings Article | 21 May 2011 Paper

Uncooled detector development at Raytheon

S. Black, T. Sessler, E. Gordon, R. Kraft, T. Kocian, M. Lamb, R. Williams, T. Yang

Proceedings Volume 8012, 80121A (2011) https://doi.org/10.1117/12.887816

KEYWORDS: Semiconducting wafers, Resistance, Sensors, Bolometers, Microbolometers, Silicon, Readout integrated circuits, Reticles, Process control, Electronics

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Proceedings Article | 7 May 2009 Paper

Large format short-wave infrared (SWIR) focal plane array (FPA) with extremely low noise and high dynamic range

David Acton, Michael Jack, Todd Sessler

Proceedings Volume 7298, 72983E (2009) https://doi.org/10.1117/12.818695

KEYWORDS: Short wave infrared radiation, Sensors, High dynamic range imaging, Readout integrated circuits, Cameras, Imaging systems, Staring arrays, Electrons, Indium gallium arsenide, Image processing

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Proceedings Article | 15 May 2008 Paper

RVS uncooled sensor development for tactical applications

S. Black, M. Ray, C. Hewitt, R. Wyles, E. Gordon, K. Almada, S. Baur, M. Kuiken, D. Chi, T. Sessler

Proceedings Volume 6940, 694022 (2008) https://doi.org/10.1117/12.786615

KEYWORDS: Sensors, Staring arrays, Microbolometers, Cameras, Electronics, Thermography, Interfaces, Video, Readout integrated circuits, Nonuniformity corrections

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Proceedings Article | 14 May 2007 Paper

640 × 512 17 µm microbolometer FPA and sensor development

D. Murphy, M. Ray, J. Wyles, C. Hewitt, R. Wyles, E. Gordon, K. Almada, T. Sessler, S. Baur, D. Van Lue, S. Black

Proceedings Volume 6542, 65421Z (2007) https://doi.org/10.1117/12.724345

KEYWORDS: Sensors, Staring arrays, Microbolometers, Readout integrated circuits, Electronics, Thermography, Bolometers, Interfaces, Silicon, Power supplies

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Proceedings Article | 17 May 2006 Paper

High sensitivity 640 × 512 (20 μm pitch) microbolometer FPAs

D. Murphy, M. Ray, A. Kennedy, J. Wyles, C. Hewitt, R. Wyles, E. Gordon, T. Sessler, S. Baur, D. Van Lue, S. Anderson, R. Chin, H. Gonzalez, C. Le Pere, S. Ton

Proceedings Volume 6206, 62061A (2006) https://doi.org/10.1117/12.674018

KEYWORDS: Staring arrays, Sensors, Microbolometers, Electronics, Readout integrated circuits, Cameras, Nonuniformity corrections, Thermography, Resistance, Infrared imaging

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RVS has made a significant breakthrough in the development of a 640 × 512 array with a unit cell size of 20μm × 20 μm and performance equivalent to that of the 25μm arrays. The successful development of this array is the first step in achieving mega-pixel formats. This FPA is designed to ultimately achieve performance near the temperature fluctuation limited NETD (<20mK, f/1, 30 Hz). The SB-300 is a highly productized readout and is designed to achieve very good sensitivity (low NETD and low spatial noise) and good dynamic range. The improved performance is through bolometer structure improvements and an innovative ROIC design. It also has a simple and flexible electrical interface which allows external electronics to be small, light, low-cost, and low-power. Almost all adjustments can be made through the serial interface; hence there is no need for external adjustable (DAC) circuitry. The improved power supply rejection helps maintain highly stable detector and strip resistor bias voltages which helps reduce spatial noise and image artifacts. We will show updated performance and imagery on these arrays, which is currently being measured at <30mK, f/1,555 30 Hz. Pixel operability is greater than 99.5% on most FPAs, where the uncorrected responsivity nonuniformity is less than 4% (sigma/mean), and time constant for these arrays was measured at <8msec. We will report detailed FPA performance results including responsivity, noise, uniformity and pixel operability. We also plan to present video imagery from the most recent FPAs. The reduction in pixel size offers several potential benefits for IR systems. For a given system resolution (IFOV) requirement, the 20 μm pixel will allow an optical volume that is 50 % the size of a 25 μm based system! We will also provide an update on the enhanced performance and yield producibility of our NVESD ManTech 640 × 480 25 μm arrays, and also show data on 25 μm arrays that have been designed for faster time constants (5 ms), while maintaining high performance. We will also show the improvement in our uncooled 320 × 240 and 640 × 480 sensor electronics in terms of reduced power and size for helmet and rifle mounted sensors.

Proceedings Article | 31 May 2005 Paper

Megapixel InGaAs arrays for low background applications

Alan Hoffman, Todd Sessler, Joseph Rosbeck, David Acton, Martin Ettenberg

Proceedings Volume 5783, (2005) https://doi.org/10.1117/12.607635

KEYWORDS: Sensors, Indium gallium arsenide, Readout integrated circuits, Astronomy, Data modeling, Quantum efficiency, Short wave infrared radiation, Cameras, Amplifiers, Electrons

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Proceedings Article | 31 May 2005 Paper

Expanded applications for high performance VOx microbolometer FPAs

D. Murphy, M. Ray, A. Kennedy, J. Wyles, C. Hewitt, R. Wyles, E. Gordon, T. Sessler, S. Baur, D. Van Lue, S. Anderson, R. Chin, H. Gonzalez, C. Le Pere, S. Ton, T. Kostrzewa

Proceedings Volume 5783, (2005) https://doi.org/10.1117/12.609462

KEYWORDS: Microbolometers, Staring arrays, Sensors, Readout integrated circuits, Thermography, Infrared imaging, Bolometers, Mid-IR, Resistance, Electronics

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Proceedings Article | 30 August 2004 Paper

Performance improvements for VOx microbolometer FPAs

Daniel Murphy, Michael Ray, Jessica Wyles, James Asbrock, C. Hewitt, Richard Wyles, Eli Gordon, T. Sessler, Adam Kennedy, Stefan Baur, David Van Lue, Steven Anderson, Richard Chin, H. Gonzales, C. Le Pere, S. Ton, Thomas Kostrzewa

Proceedings Volume 5406, (2004) https://doi.org/10.1117/12.548883

KEYWORDS: Microbolometers, Staring arrays, Sensors, Readout integrated circuits, Imaging systems, Electronics, Infrared imaging, Thermography, Resistance, Semiconducting wafers

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Proceedings Article | 10 October 2003 Paper

Resolution and sensitivity improvements for VOx microbolometer FPAs

Daniel Murphy, Adam Kennedy, Michael Ray, Richard Wyles, Jessica Wyles, James Asbrock, C. Hewitt, David Van Lue, T. Sessler, John Anderson, Daryl Bradley, Richard Chin, H. Gonzales, C. Le Pere, Thomas Kostrzewa

Proceedings Volume 5074, (2003) https://doi.org/10.1117/12.487657

KEYWORDS: Microbolometers, Sensors, Staring arrays, Readout integrated circuits, Resistance, Thermography, Imaging systems, Electronics, Cameras, Unmanned aerial vehicles

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Raytheon Vision Systems (RVS) has achieved a significant technical breakthrough in uncooled FPAs by reducing the pixel size by a factor of two while maintaining state-of-the-art sensitivity. Raytheon is producing high-quality 320 x 240 microbolometer FPAs with 25 μm pitch pixels. The 320 x 240 FPAs have a sensitivity that is comparable to microbolometer FPAs with 50 μm pixels. The array average NETD value for these FPAs is about 30 mK with an f/1 aperture and operating at 30 Hz frame rates. Pixel operability is greater than 99% on most FPAs, and uncorrected responsivity nonuniformity is less than 4% (sigma/mean). These 25 μm microbolometer detectors also have a relatively fast thermal time constant of approximately 10 msec. This state-of-the-art performance has been achieved as a result of an advanced micro machining fabrication process, which allows maximization of both the thermal isolation and the optical fill-factor. These arrays have produced excellent image quality, and are currently fielded in demonstration systems. The reduction in pixel size offers several potential benefits for IR systems. For a given system resolution (IFOV) requirement, the 25 μm pxiels allow a factor of two reduction in both the focal length and aperture size of the sensor optics. These FPAs are applicable to wide-field-of-view, long-range surveillance and targeting missions. The pixel size reduction facilitates a significant FPA cost reduction since the number of die printed on a wafer can be increased, and also has enabled the development of a large-format 640 x 480 FPA array. Raytheon is producing these arrays with very good sensitivity. These arrays have excellent operability and image quality. Several dual FOV prototype systems have been delivered under the LCMS and UAV programs, and are under evaluation at NVESD. Raytheon Vision Systems (RVS) has developed a flexible uncooled front end (UFE) electronics that will serve as the basis for camera engine systems using 320 x 240 and 640 x 480 FPAs. The focus has been to develop architecture suitable for a wide variety of systems from low cost modest performance to high performance military applications. This product has been designed with military environmental and shock and vibration conditions in mind. Intended for small pxiel, high performance applications, the UFE is the ideal cornerstone for ground and airborne UAV, multi-mode sneosr, weapon sight or seeker architectures.

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