Thomas W. Osborne
Engineer at Qualcomm Technologies Inc
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 12 March 2013
Proc. SPIE. 8650, Three-Dimensional Image Processing (3DIP) and Applications 2013
KEYWORDS: Target detection, 3D acquisition, Stars, Imaging systems, Cameras, 3D metrology, Projection systems, Rubidium, 3D image processing, Structured light

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