Cantilever based sensor system are a well-established sensor family exploited in several every-day life applications as well as in high-end research areas. The very high sensitivity of such systems and the possibility to design and functionalize the cantilevers to create purpose built and highly selective sensors have increased the interest of the scientific community and the industry in further exploiting this promising sensors type. Optical deflection detection systems for cantilever sensors provide a reliable, flexible method for reading information from cantilevers with the highest sensitivity. However the need of using multi-cantilever arrays in several fields of application such as medicine, biology or safety related areas, make the optical method less suitable due to its structural complexity. Working in the frame of a the Joint Undertaking project Lab4MEMS II our group proposes a novel and innovative approach to solve this issue, by integrating a Micro-Opto-Electro-Mechanical-System (MOEMS) with dedicated optics, electronics and software with a MOEMS micro-mirror, ultimately developed in the frame of Lab4MEMSII. In this way we are able to present a closely packed, lightweight solution combining the advantages of standard optical read-out systems with the possibility of recording multiple read-outs from large cantilever arrays quasi simultaneously.
This paper covers research results on development of the cantilevers beams test structures for interconnects reliability and robustness investigation. Presented results include design, modelling, simulation, optimization and finally fabrication stage performed on 4 inch Si wafers using the ITE microfabrication facility. This paper also covers experimental results from the test structures characterization.
Silicon nanowires (SiNWs) have undergone intensive research for their application in novel integrated systems such as
field effect transistor (FET) biosensors and mass sensing resonators profiting from large surface-to-volume ratios (nano
dimensions). Such devices have been shown to have the potential for outstanding performances in terms of high
sensitivity, selectivity through surface modification and unprecedented structural characteristics. This paper presents the
results of mechanical characterization done for various types of suspended SiNWs arranged in a 3D array. The
characterization has been performed using techniques based on atomic force microscopy (AFM). This investigation is a
necessary prerequisite for the reliable and robust design of any biosensing system. This paper also describes the applied
investigation methodology and reports measurement results aggregated during series of AFM-based tests.
Increased interest in micro-and nano-electromechanical systems (MEMS and NEMS) entail the development of reliable measurement techniques for the basic parameters of the designed and manufactured devices. The proposed methodology should provide high resolution, wide frequency range and the possibility to investigate both mechanical and electrical parameters during inspection process. In this article authors present methods for manufacturing of electrostatic MEMS devices. Measurement techniques will be presented for specifying parameters such as resonant frequency, quality factor and sensitivity of the previously manufactured structures. Manufacturing techniques will be presented on the example of the micropusher structure, whereas measurement techniques will be presented on the example of the microgripper structure.