The market of Photonic integrated circuits (PICs) has risen significantly in the previous decade. One of the major challenges to SMEs is to reduce cost and effort of packaging and pre-package testing. The PIXAPP pilot line aims to address these challenges and fill missing links in the technology chain in the context of photonics pilot manufacturing. As part of the PIXAPP pilot line, we enable time-efficient PIC characterization and validation, which is indispensable for a cost-effective manufacturing chain. A fast alignment process of optical in- and outputs to the PIC is critical to reduce the cycle times for testing. There are many underlying factors that influence achievable alignment times, such as mode field diameter, mode mismatch between waveguide and fiber, available optical power, measurement noise, the mechanical properties of the setup, controller environment, strategies used to find first light, alignment algorithms and parallelization by employing fiber arrays. We discuss a selection of these factors. Among the covered topics are the available acceleration of the mechanical axes, fiber holder stiffness, motion controller frequency and parallelization by Periscope arrays for edge coupling on the wafer scale. We demonstrate the applicability of our findings by a double sided fiber alignment in 1.7s.
Highly complex optical fiber networks are the physical backbone of the internet today. For about two decades, the amount of data transferred through the optical networks keeps rising with no end being in sight. To fully use the capacity of the available optical mesh networks, more and more complex optoelectronic devices like Optical Cross-Connects, Wavelength Selective Switches and highly integrated Transceivers are being established. State of the art devices, e.g. WSS (Wavelength Selective Switch) can have 20 or more optical components, which is challenging and time consuming for conventional alignment routines. While these alignment routines are based on a stepwise alignment of single optical components, we propose a novel approach by simultaneously aligning pre-analyzed components and subgroups. The alignment strategy follows the optical functionality of the components being aligned: Prior to the assembly the module and each component once is being examined regarding their function and influence on the optical properties of the module being assembled. Functional sub-groups of components are investigated in the same manner. With this knowledge of each component’s influence on the optical properties of the module, it is possible to perform the simultaneous alignment with different alignment goals. Usually, it is desirable to minimize losses, but in some cases, the wavelength-dependent loss or the polarization-dependent loss can be of greater interest. In optical devices with dispersive elements like gratings and prisms, this approach can be applied to directly tailor the wavelength range or the wavelength resolution to the customer needs, while other properties are kept constant. In general, this approach allows adjusting optical properties independently from each other and can drastically reduce assembly times.
Miniaturized video endoscopes with an imager located at the distal end and a simplified opto-mechanical layout are
presented. They are based on a CMOS imager with 650 x 650 pixels of 2.8 μm pitch and provide straight view with 75° and 110° field of view at f/4.3. They have an outer diameter of 3 mm including the shell and a length of approx. 8 mm.
The optics consist of polymer lenses in combination with a GRIN and a dispensed lens. Using a simple flip chip
assembly, optical axis alignment better than 10 μm and a contrast of 30 % at 90 LP/mm was achieved. The 75° FOV
system was sealed at the front window using a solderjetting technology, providing 10<sup>-9</sup> mbar*l/s leakage rates even after
several autoclave cycles.
Conference Committee Involvement (6)
Components and Packaging for Laser Systems VI
3 February 2020 | San Francisco, California, United States
Components and Packaging for Laser Systems V
4 February 2019 | San Francisco, California, United States
Components and Packaging for Laser Systems IV
30 January 2018 | San Francisco, California, United States
Components and Packaging for Laser Systems III
31 January 2017 | San Francisco, California, United States
Components and Packaging for Laser Systems II
16 February 2016 | San Francisco, California, United States
Components and Packaging for Laser Systems
9 February 2015 | San Francisco, California, United States