Torsten Vahrenkamp
Chief Executive Officer at ficonTEC Service GmbH
SPIE Involvement:
Conference Program Committee | Author
Publications (3)

Proceedings Article | 8 April 2019
Proc. SPIE. 10899, Components and Packaging for Laser Systems V
KEYWORDS: Packaging, Signal to noise ratio, Waveguides, Single mode fibers, Optical testing, Distance measurement, Photonic integrated circuits, Optical alignment, Semiconducting wafers, Motion controllers

Proceedings Article | 4 March 2019
Proc. SPIE. 10899, Components and Packaging for Laser Systems V
KEYWORDS: Transceivers, Optical components, Optical testing, Photonic integrated circuits, Optical alignment, Data communications, Optical testing equipment, Tolerancing, Assembly equipment

Proceedings Article | 22 February 2011
Proc. SPIE. 7893, Endoscopic Microscopy VI
KEYWORDS: GRIN lenses, Imaging systems, Polymers, Video, Ceramics, Endoscopes, Objectives, Modulation transfer functions, Spherical lenses, Optics manufacturing

Conference Committee Involvement (6)
Components and Packaging for Laser Systems VI
3 February 2020 | San Francisco, California, United States
Components and Packaging for Laser Systems V
4 February 2019 | San Francisco, California, United States
Components and Packaging for Laser Systems IV
30 January 2018 | San Francisco, California, United States
Components and Packaging for Laser Systems III
31 January 2017 | San Francisco, California, United States
Components and Packaging for Laser Systems II
16 February 2016 | San Francisco, California, United States
Showing 5 of 6 Conference Committees
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