Enhanced tracking is accomplished by increasing the resolution, frame rate and processing capabilities in tracking
dynamic regions of interest for vision applications. In many proven algorithms, the ability to distinguish an object and
track it is dependent on the system performance in more than one attribute. We have conducted studies on proven
techniques such as Active Appearance Models, Principle Component Analysis and Eigen tracking. All perform better as
the camera resolution increases, and camera frame rate increases. Additional opportunities have been observed by
combining these techniques, taking advantage of Multicore CPUs, and GPU graphic card processing. Results from an 8
Megapixel commercial sensor combined with a Field Programmable Gate array are presented, and algorithm
performance compared with down scaled images of the same scenes, and simulated typical 30 hertz frame rates verses
the 120 hertz to 300 hertz typical of this smart camera.
The art of optical motion capture combines computational devices with optical detectors. The spatial and temporal resolutions desired require millions of discrete detection locations, or pixels, operating at frame rates ranging from several hertz to several thousand hertz. Processing frames from multiple detectors in real time, requires several billion operations to be performed per second. The process expands as the frame rate or resolution increases. One technique suggested here is utilization of orthogonal one dimensional (1-D) CCD or linear array detectors, instead of the more common two dimensional (2-D) CCD or area array detectors. A brief description of the advantages of the linear arrays is provided based on experience with an actual system, validating empirical supposition with proven results. Extrapolations into future developments are suggested, combining the best of both designs.
Diamond's thermal, mechanical, chemical, electrical and optical properties are ideally
suited to the requirements of multichip modules. Gigahertz clock rates and increased device
density are facilitated using diamond as a base material and as a hermetic passivation layer. Three
dimensional architectures with optical communications would allow high speed communications
for advanced designs in computers and rugged electronics. This paper provides an overview of
potential applications and advantages of Diamond Multichip Modules.