Dr. Umberto Iessi
Lithography Scanner group mgr at Micron Agrate
SPIE Involvement:
Author
Publications (8)

PROCEEDINGS ARTICLE | March 4, 2010
Proc. SPIE. 7640, Optical Microlithography XXIII
KEYWORDS: Wafer-level optics, Thin films, Lithography, Reticles, Statistical analysis, Scanners, Critical dimension metrology, Semiconducting wafers, Thin film devices, 193nm lithography

PROCEEDINGS ARTICLE | March 4, 2010
Proc. SPIE. 7640, Optical Microlithography XXIII
KEYWORDS: Chromatic aberrations, Lithography, Metrology, Laser applications, Distortion, Laser stabilization, Optical simulations, Immersion lithography, Critical dimension metrology, Overlay metrology

PROCEEDINGS ARTICLE | March 16, 2009
Proc. SPIE. 7274, Optical Microlithography XXII
KEYWORDS: Lithography, Reticles, Lithographic illumination, Scanners, Wavefronts, Distortion, Semiconducting wafers, Yield improvement, Overlay metrology, Device simulation

PROCEEDINGS ARTICLE | March 25, 2008
Proc. SPIE. 6922, Metrology, Inspection, and Process Control for Microlithography XXII
KEYWORDS: Lithography, Metrology, Diffractive optical elements, Data modeling, Scanners, 3D modeling, Finite element methods, Neural networks, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | March 7, 2008
Proc. SPIE. 6924, Optical Microlithography XXI
KEYWORDS: Lithography, Metrology, Optical lithography, Etching, Scanners, Photomasks, Double patterning technology, Optical alignment, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | March 24, 2006
Proc. SPIE. 6152, Metrology, Inspection, and Process Control for Microlithography XX
KEYWORDS: Lithography, Metrology, Metals, Image segmentation, Scanners, Scanning electron microscopy, Semiconducting wafers, Overlay metrology, Chemical mechanical planarization, Front end of line

Showing 5 of 8 publications
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