Dr. Uzodinma Okoroanyanwu
Research Associate Professor at
SPIE Involvement:
Senior status | Conference Program Committee | Author | Instructor
Area of Expertise:
Physical chemistry , Polymer chemistry , Lithography , Organic electronics , Printed electronics , Flexible electronics
Profile Summary

Uzodinma Okoroanyanwu is a research associate professor in the department of polymer science and engineering of University of Massachusetts at Amherst. His research interests are broadly geared toward developing printed, flexible, flexible hybrid, and wearable electronic sensor platforms used in point-of-care diagnostics and environmental monitoring. He is also the founder and chief executive officer of Enx Labs (formerly called ALLNANO LLC), a company that develops electronic instruments used in molecular diagnostics, energy storage, and environmental monitoring. He worked previously at Advanced Micro Devices, where he spent 12 years conducting research on advanced lithography and on organic polymer memories, and at GLOBALFOUNDRIES, where he spent 4 years conducting research on advanced lithography. He has published extensively on lithography science and technology and on electronic applications of polymers. His books include: Molecular Theory of Lithography (published in 2015) and Chemistry and Lithography (published in 2010). A holder of 37 U.S patents, he was educated at The University of Texas at Austin, where he earned the following degrees: Ph.D. physical chemistry (1997), M.S. chemical engineering (1995), M.A. physical chemistry (1994), B.S. Chemistry and Chemical engineering (1991).
Publications (41)

SPIE Press Book | December 17, 2015

Proc. SPIE. 8441, Photomask and Next-Generation Lithography Mask Technology XIX
KEYWORDS: Contamination, Particles, Coating, Manufacturing, Inspection, Reflectivity, Photomasks, Extreme ultraviolet, Ruthenium, Mask cleaning

Proc. SPIE. 8352, 28th European Mask and Lithography Conference
KEYWORDS: Mirrors, Defect detection, Inspection, Reflectivity, Scanning electron microscopy, Optical inspection, Photomasks, Extreme ultraviolet, Semiconducting wafers, Defect inspection

Proc. SPIE. 7971, Metrology, Inspection, and Process Control for Microlithography XXV
KEYWORDS: Lithography, Deep ultraviolet, Polarization, Scattering, Etching, Light scattering, Inspection, Bridges, Extreme ultraviolet, Semiconducting wafers

Proc. SPIE. 7969, Extreme Ultraviolet (EUV) Lithography II
KEYWORDS: Magnesium, Polymers, Glasses, Molecules, Hydrogen, Diffusion, Photoresist materials, Extreme ultraviolet, Extreme ultraviolet lithography, Chemical elements

SPIE Press Book | December 28, 2010

Showing 5 of 41 publications
Conference Committee Involvement (10)
Extreme Ultraviolet (EUV) Lithography VII
22 February 2016 | San Jose, California, United States
Extreme Ultraviolet (EUV) Lithography VI
23 February 2015 | San Jose, California, United States
Extreme Ultraviolet (EUV) Lithography V
24 February 2014 | San Jose, California, United States
Extreme Ultraviolet (EUV) Lithography IV
25 February 2013 | San Jose, California, United States
Extreme Ultraviolet (EUV) Lithography III
13 February 2012 | San Jose, California, United States
Showing 5 of 10 published special sections
Course Instructor
SC1099: Chemistry and Lithography
This course, based on the next edition of the book with the same title, explores the chemical basis of advanced lithography, which in all its essential aspects is about chemical transformations that are designed to print a relief image of an object on a flat surface. The object may be a mask containing patterns of integrated circuit devices; the flat surface may be a silicon wafer coated with photo- or radiation-sensitive resist, which upon exposure and development, or imprinting (as in the case of imprint resists), or directed self-assembly (as in the case of block copolymer resists), is transformed into the relief image of the mask. Underlying these transformations are distinct chemical reactions that are mediated by electrons. By drawing on fundamental, theoretical and experimental studies of molecular processes in advanced lithography, we will deconstruct lithography into its essential chemical principles. We will examine and show how electrons mediate the photo- and radiation chemistry of exposure processes of resists (be they organic, organometallic, polymeric or inorganic), as well as exposure tool sources (be they mercury arc lamp, laser, electron beam, ion beam, or plasma); colloid chemistry of resist formulation and dissolution (be it for positive tone or negative tone development), wafer and mask cleaning processes; electrochemistry of mask absorber corrosion, electrostatic discharge, and electromigration; surface chemistry of wafer and mask priming, along with thin film interfacial effects; materials chemistry of resists, exposure tool optics, and masks; environmental chemistry of the exposure environment (be it water, air or vacuum), as well as of resist poisoning; process chemistry and modeling of wafer and mask making lithographic unit operations, including substrate priming, coating, exposure, pre- and post-exposure baking, development, and post-exposure stabilization processes; inorganic and organometallic chemistry of mask defect formation and repair, of mask contamination from inorganic salt (haze) crystal growth, carbon deposition and oxidation; and polymer chemistry of directed block copolymer self-assembly.
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