Dr. Val R. Marinov
Associate Professor at North Dakota State Univ
SPIE Involvement:
Author
Area of Expertise:
laser methods for microelectronics packaging , ultrathin, ultra-small semiconductor dies , chip-in-paper and chip-on-flex packaging
Profile Summary

Val R. Marinov graduated magna cum laude with B.Sc. and M.Sc. degrees in manufacturing engineering from the Technical University, Rousse, Bulgaria, in 1979. He received his Ph.D. degree in manufacturing engineering from the Technical University of Sofia, Bulgaria in 1992.
He has seven years of industrial and more than 25 years of academic experience in the area of manufacturing engineering for metal, plastic, and electronic products. Currently, he is an Associate Professor of Manufacturing Engineering at North Dakota State University (NDSU), Fargo, ND. Prior to joining NDSU, he served on the faculty at Eastern Mediterranean University, Cyprus (1997–2000). His prior affiliations include the Technical University in Plovdiv, Bulgaria (1987–1997) and the Laboratory for Precision Machining and Machine Tools, Korea Advanced Institute of Science and Technology, Taejon, South Korea (1993–1994).
Since 2002 Dr. Marinov has been associated with the NDSU Center for Nanoscale Science and Engineering (CNSE), Fargo, ND, where he has been leading some of the most successful large research teams composed of undergraduate and graduate students, staff researchers, and NDSU faculty. Under his leadership and based on his recent invention, his research team was the first in the world to demonstrate in 2011 the use of lasers for contactless packaging of functional microelectronic devices. This work was featured in an NDSU press release and attracted the attention of many professionals in the field. Recently, Dr. Marinov’s team has reported, again for the first time, embedding ultrathin RFID chips in paper for applications such as security and financial paper, smart labels and tickets, RFID banknotes, and many more, using the laser-enabled advanced packaging (LEAP) technology pioneered by the team.
Dr. Marinov has (co)authored over fifty publications in broad and diversified fields, most recently in the area of laser methods for advanced microelectronics packaging.
Publications (4)

PROCEEDINGS ARTICLE | March 15, 2013
Proc. SPIE. 8608, Laser-based Micro- and Nanopackaging and Assembly VII
KEYWORDS: Packaging, Semiconductors, Silicon, Manufacturing, Laser applications, Antennas, Reactive ion etching, Semiconducting wafers, Adhesives, Nanolithography

PROCEEDINGS ARTICLE | May 15, 2010
Proc. SPIE. 7690, Three-Dimensional Imaging, Visualization, and Display 2010 and Display Technologies and Applications for Defense, Security, and Avionics IV
KEYWORDS: Silica, Luminescence, Quantum dots, Infrared lasers, 3D displays, Fluorescent materials, 3D image processing, 3D volumetric displays, Absorption

PROCEEDINGS ARTICLE | February 20, 2008
Proc. SPIE. 6879, Photon Processing in Microelectronics and Photonics VII
KEYWORDS: Electronics, Nanoparticles, Electrodes, Silver, Manufacturing, Resistance, Microelectronics, Oscilloscopes, Camera shutters, Laser sintering

PROCEEDINGS ARTICLE | November 11, 2004
Proc. SPIE. 5605, Intelligent Systems in Design and Manufacturing V
KEYWORDS: Calibration, Manufacturing, Inspection, Computing systems, Computer simulations, Telecommunications, Virtual reality, Product engineering, Systems modeling, Prototyping

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