In the present work, we report a new technique for preparing phospho-silicste-glass (PSG) films using RF magnetron
sputtering process. For this, purpose, a 76 mm diameter target of phosphorus-doped silicon dioxide was prepared by
conventional solid-state reaction route using P2O5 and SiO2 powders. Since P2O5 is hygroscopic in nature, special care
was taken to prevent lump formation due to moisture incorporation during the target making process. The PSG films
were prepared in a RF (13.56 MHz) magnetron sputtering system at 200-300 watt RF power, 10-20 mTorr pressure and
45 mm target-to-substrate spacing without external substrate heating. The thickness, refractive index (n) and the
absorption coefficient (k) of the films were measured using a thin-film analyzer. To confirm the presence of phosphorus
in the deposited films, hot-probe test and the sheet resistance measurements were performed. As a final confirmatory
test, a p-n diode was fabricated in a p-type Si wafer using the deposited film as a source of phosphorus diffusion. The
phosphorus concentration in the target and the deposited film were analyzed using energy dispersive X-rays (EDAX)
tool. The etch rate of the PSG film in buffered HF was measured to be about 30 times higher as compared to that of
thermally grown SiO2 films. The issues related to the use of RF sputtered PSG films as sacrificial layer in surface
micromachining technology have been addressed.
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