Dr. Vladimir Szekely
at Budapest Univ of Technology and Economics
SPIE Involvement:
Author
Publications (12)

Proceedings Article | 25 March 2003 Paper
Proc. SPIE. 4945, MEMS/MOEMS: Advances in Photonic Communications, Sensing, Metrology, Packaging and Assembly
KEYWORDS: Computer simulations, Microelectromechanical systems, Thermal modeling, Chemical elements, Matrices, Metals, Fused deposition modeling, Dielectrics, Electrodes, Differential equations

Proceedings Article | 19 April 2002 Paper
Proc. SPIE. 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002
KEYWORDS: Microelectromechanical systems, Thermal modeling, Computer simulations, Chemical elements, Algorithm development, Optical simulations, Instrument modeling, Thermal effects, Microelectronics, Finite element methods

Proceedings Article | 5 April 2001 Paper
Proc. SPIE. 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001
KEYWORDS: Thermal modeling, Microelectromechanical systems, Systems modeling, Data modeling, Circuit switching, Resistance, Voltage controlled current source, Capacitance, Instrument modeling, Device simulation

Proceedings Article | 24 October 2000 Paper
Proc. SPIE. 4228, Design, Modeling, and Simulation in Microelectronics
KEYWORDS: Computer aided design, Microelectromechanical systems, Packaging, Finite element methods, Bridges, Microelectronics, 3D modeling, Sensors, System on a chip, Data modeling

Proceedings Article | 10 April 2000 Paper
Proc. SPIE. 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS
KEYWORDS: Thermal modeling, Microelectromechanical systems, Fused deposition modeling, Deconvolution, Instrument modeling, Convolution, Packaging, Einsteinium, Performance modeling, Microelectronics

Showing 5 of 12 publications
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