Dr. Vladimir A. Ukraintsev
Engineer at Nanometrology International Inc
SPIE Involvement:
Senior status | Conference Chair | Conference Co-Chair | Conference Program Committee | Symposium Committee | Editor | Author | Instructor
Area of Expertise:
critical dimension metrology , reference metrology , scanning probe microscopy , physical characterization , nanoprobing , surface science
Websites:
Profile Summary

Vladimir Ukraintsev has PhD in Solid State Physics. Before joining Qorvo, Inc. Vladimir founded Nanometrology International, Inc., directed Technical Marketing at Veeco Instruments and developed metrology solutions for 6 technologies at Texas Instruments. Vladimir published over 85 articles focusing on development of metrology and characterization solutions for industrial applications.
Publications (23)

PROCEEDINGS ARTICLE | March 13, 2018
Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII
KEYWORDS: Metrology, Optical lithography, Data modeling, Scanners, 3D modeling, Scanning electron microscopy, Photoresist materials, Optical proximity correction, Critical dimension metrology, Process modeling

SPIE Journal Paper | June 4, 2013
JM3 Vol. 12 Issue 02
KEYWORDS: Atomic force microscopy, Data modeling, 3D modeling, Numerical analysis, Error analysis, Metrology, Statistical modeling, Carbon nanotubes, Solids, Standards development

PROCEEDINGS ARTICLE | April 3, 2012
Proc. SPIE. 8324, Metrology, Inspection, and Process Control for Microlithography XXVI
KEYWORDS: Semiconductors, Metrology, Statistical analysis, Data modeling, 3D modeling, Atomic force microscopy, Numerical analysis, 3D metrology, Statistical modeling, Standards development

Showing 5 of 23 publications
Conference Committee Involvement (21)
Metrology, Inspection, and Process Control for Microlithography XXXIII
24 February 2019 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXII
26 February 2018 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXI
27 February 2017 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXX
22 February 2016 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXIX
23 February 2015 | San Jose, California, United States
Showing 5 of 21 published special sections
Course Instructor
SC1006: Nanoscale Dimensional Metrology and Physical Characterization
This course provides attendees with a working knowledge of in-line critical dimension and reference metrology as well as with the basics of some techniques of semiconductor physical characterization. It is based on metrology and physical characterization practices currently employed in nanoscale semiconductor research, development and manufacturing. The course starts with definitions of commonly used metrology terms, reviews current challenges and explains the importance of metrology and characterization in achieving R&D and manufacturing goals. Basic critical dimensional metrology (ECD, SEM, SIM, OCD, 3DAFM) and some nanoscale physical characterization techniques (c-AFM, SCM, SSRM, KPSPM, SPVSPM, TERS) are reviewed. Their physical principles, merits and limitations are discussed. The material leads to the conclusion that only a combination of metrology and characterization techniques can solve the complex problems which semiconductor and nanotechnology research, development and manufacturing are facing today. The final topic of the course is about future hybrid instrumentation and methodologies which are coming to nanoscale dimensional metrology and physical characterization.
SC956: Basics and Industrial Applications of AFM
This course provides attendees with a basic working knowledge of atomic force microscopy (AFM) and industrial critical dimension (CD) metrology. After an introduction to AFM technology the course will focus on modern industrial applications of CDAFM. The most common AFM applications in semiconductor and data storage R&D and manufacturing are reviewed. For every application AFM is compared with other possible metrology solutions, and the merits and limitations of each metrology solution are detailed. The final part of the course deals with SI-traceability and uncertainty of AFM measurements. AFM is presented as a potential reference metrology tool.
SC943: Basics of In-Line Critical Dimension Metrology
This course provides attendees with a basic working knowledge of critical dimension metrology. The course starts with definitions of commonly used metrology terms, reviews current challenges and explains importance of metrology in achieving semiconductor manufacturing goals. All basic patterning metrology techniques are reviewed through the course. Their physical principles, merits and limitations are detailed. The material leads to the conclusion that only a combination of various metrology techniques may solve complex problems which semiconductor manufacturing is facing today. The final topic of the course is a reference dimensional metrology which cements various techniques in a single metrology solution.
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