Dr. Weiming Ren
Fellow at ASML/HMI USA
SPIE Involvement:
Author
Publications (9)

PROCEEDINGS ARTICLE | October 3, 2018
Proc. SPIE. 10810, Photomask Technology 2018
KEYWORDS: Defect detection, Inspection, Computing systems, Scanning electron microscopy, Wafer inspection, Photomasks, Extreme ultraviolet lithography, Semiconducting wafers, Defect inspection

PROCEEDINGS ARTICLE | March 13, 2018
Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII
KEYWORDS: Lithography, Electron beams, Metrology, Logic, Scanners, Extreme ultraviolet lithography, Optical proximity correction, Critical dimension metrology, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | March 13, 2018
Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII
KEYWORDS: Semiconductors, Image processing, Inspection, Computing systems, Scanning electron microscopy, Image quality, Photomasks, Extreme ultraviolet, Semiconducting wafers

PROCEEDINGS ARTICLE | June 16, 2003
Proc. SPIE. 5037, Emerging Lithographic Technologies VII
KEYWORDS: Wafer-level optics, Electron beam lithography, Diffraction, Point spread functions, Reticles, Distortion, Convolution, Geometrical optics, Semiconducting wafers, Projection lithography

SPIE Journal Paper | June 1, 1998
OE Vol. 37 Issue 06
KEYWORDS: Image segmentation, Binary data, Cameras, Calibration, 3D image processing, Image processing, Image analysis, Environmental sensing, Image processing algorithms and systems, Inspection

PROCEEDINGS ARTICLE | November 14, 1996
Proc. SPIE. 2847, Applications of Digital Image Processing XIX
KEYWORDS: 3D acquisition, Cameras, Image segmentation, Image processing, Image acquisition, Image analysis, Data acquisition, 3D metrology, Binary data, 3D image processing

Showing 5 of 9 publications
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