The anisotropy of material removal rate for diamond gives a method to control the lapping rate of diamond specimen, i.e. changing the lapping direction. This requires comprehension on the relationship of the material removal rate and the lapping direction for diamond. This paper provides a method to figure out the diamond lapping direction. By preprocessing a straight edge formed by lapping a surface intersects with the required machining surface, the diamond lapping direction can be figured out under the Confocal Scanning Laser Microscope only if the crystal directions of the two surfaces are determined at first. The advantage of our method is that there is no need to consider the position and posture of the diamond specimen fixed on the holder.
In order to satisfy the machining of high precision components, much higher accuracies have been put forward for diamond cutting tools. From the viewpoints of fabrication and utilization of rounded diamond cutting tools, the material removal mechanism of lapped diamond surface layer is studied by lapping experiments. And also, the crucial processes for tool fabrication and re-lapping are analyzed and discussed. Moreover, the working state of lapping equipment affecting tool lapping quality is lucubrated. At the same time, the representative qualifications of rounded diamond cutting tools are defined and their assessment methods are proposed, respectively. Finally, in terms of the relationship of the removal mechanism and tool lapping quality, the lapping parameters are optimized for the fabrication of high precision diamond cutting tools. The results indicate the sharpness can be reduced to 30nm.