Current spectroscopic detector crystals contain defects that prevent economic production of devices with sufficient
energy resolution and stopping power for radioisotope discrimination. This is especially acute for large monolithic
crystals due to increased defect opportunity. The proposed approach to cost reduction starts by combining stereoscopic
IR and ultrasound (UT) inspection coupled with segmentation and 3D mapping algorithms. A "smart dicing" system
uses "random-access" laser-based machining to obtain tiles free of major defects. Application specific grading matches
defect type to anticipated performance. Small pieces combined in a modular sensor pack instead of a monolith will
make the most efficient use of wafer area.