William J. Huang
Applications Engineer at KLA-Tencor Corp
SPIE Involvement:
Author
Publications (4)

PROCEEDINGS ARTICLE | September 29, 2010
Proc. SPIE. 7823, Photomask Technology 2010
KEYWORDS: Reticles, Defect detection, Databases, Inspection, Control systems, Computational lithography, Optical proximity correction, SRAF, Semiconducting wafers, Model-based design

PROCEEDINGS ARTICLE | September 23, 2009
Proc. SPIE. 7488, Photomask Technology 2009
KEYWORDS: Lithography, Reticles, Defect detection, Image processing, Inspection, Image resolution, Wafer inspection, Photomasks, SRAF, Semiconducting wafers

PROCEEDINGS ARTICLE | May 11, 2009
Proc. SPIE. 7379, Photomask and Next-Generation Lithography Mask Technology XVI
KEYWORDS: Lithography, Reticles, Contamination, Inspection, Image resolution, Wafer inspection, Photomasks, Optical proximity correction, SRAF, Semiconducting wafers

PROCEEDINGS ARTICLE | October 30, 2007
Proc. SPIE. 6730, Photomask Technology 2007
KEYWORDS: Lithography, Reticles, Deep ultraviolet, Cameras, Etching, Inspection, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Fiber optic illuminators

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