Dr. William M. Tong
Researcher at KLA-Tencor Corp
SPIE Involvement:
Conference Program Committee | Conference Chair | Conference Co-Chair | Author | Editor
Publications (20)

PROCEEDINGS ARTICLE | March 28, 2014
Proc. SPIE. 9049, Alternative Lithographic Technologies VI
KEYWORDS: Lithography, Electron beam lithography, Mirrors, Data compression, Switching, Electrodes, Reflectivity, Printing, Error control coding, Semiconducting wafers

SPIE Journal Paper | September 30, 2013
JM3 Vol. 12 Issue 03
KEYWORDS: Lithography, High volume manufacturing, Extreme ultraviolet lithography, Optical lithography, Overlay metrology, Explosives, Metrology, Roads, Molecular self-assembly, Directed self assembly

SPIE Journal Paper | August 5, 2013
JM3 Vol. 12 Issue 03
KEYWORDS: Electrodes, Mirrors, Microelectromechanical systems, Semiconducting wafers, Tin, Electron beam lithography, Metals, Aluminum, Coating, Reflectivity

SPIE Conference Volume | April 11, 2013

PROCEEDINGS ARTICLE | March 26, 2013
Proc. SPIE. 8680, Alternative Lithographic Technologies V
KEYWORDS: Lithography, Electron beam lithography, Electron beams, Logic, Polymethylmethacrylate, Silica, Coating, Reflectivity, Printing, Semiconducting wafers

SPIE Journal Paper | August 9, 2012
JM3 Vol. 11 Issue 3
KEYWORDS: Lithography, Optical lithography, Explosives, Nanoimprint lithography, Semiconductor manufacturing, Semiconductors, Optics manufacturing, Immersion lithography, Double patterning technology, Directed self assembly

Showing 5 of 20 publications
Conference Committee Involvement (8)
Alternative Lithographic Technologies VI
24 February 2014 | San Jose, California, United States
Alternative Lithographic Technologies V
25 February 2013 | San Jose, California, United States
Alternative Lithographic Technologies IV
13 February 2012 | San Jose, California, United States
Alternative Lithographic Technologies III
1 March 2011 | San Jose, California, United States
Alternative Lithographic Technologies II
23 February 2010 | San Jose, California, United States
Showing 5 of 8 published special sections
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