The second generation circular digital variable optical attenuator (CDVOA) with an effective area of 1500 μm diameter has been designed and fabricated based on SOI technology. C-band incoming Gaussian light can be reflected to an outgoing fiber from a shiny circular area, which is divided into sectors that can be individually tilted and addressed electrostatically to achieve variable light attenuation. Using a delay mask process, each movable component i) has an underlying ridge frame to maintain flatness, ii) is suspended by two micro beams at a bridge structure that connects to a handle where aluminum electrode is located underneath, and iii) is separated by wall structures at the handle area to reduce crosstalk from adjacent electrodes. Critical fabrication processes including the mirror and chip release are performed using a HF vapor phase etcher. Fluidic pressure and chip-dicing shocks are avoided. Initial results show that a mirror sector suspended by two 345 μm long beams with a cross-section of about 5×5 μm<sup>2</sup> can be tilted to 2.8° at about 18 V driving voltage. Initial interferometric measurement gives estimated individual mirror flatness after metallic reflective coating to be about λ/15. The assembled chips are ready for further testing and characterization.
A novel surface-micromachined non-contact high-speed angular-position sensor with total surface area under 4mm2 was developed using the Multi-User MEMS Processes (MUMPs) and integrated with a commercial RF transmitter at 433MHz carrier frequency for wireless signal detection. Currently, a 2.3 MHz internal clock of our data acquisition system and a sensor design with a 13mg seismic mass is sufficient to provide visual observation of a clear sinusoidal response wirelessly generated by the piezoresistive angular-position sensing system within speed range of 180 rpm to around 1000 rpm. Experimental results showed that the oscillation frequency and amplitude are related to the input angular frequency of the rotation disk and the tilt angle of the rotation axis, respectively. These important results could provide groundwork for MEMS researchers to estimate how gravity influences structural properties of MEMS devices under different circumstances.