The electron storage ring is a realistic solution as a radiation source for production grade, industrial X-ray lithography
system. Today several large scale plans are in motion to design and implement synchrotron storage rings of different types for
this purpose in the USA and abroad. Most of the scientific and technological problems related to the physics, design and
manufacturing engineering, and commissioning of these systems for microlithography have been resolved or are under
extensive study. However, investigation on issues connected to application of Synchrotron Orbit Radiation (SOR ) in chip
production environment has been somewhat neglected.
In this paper we have filled this gap pointing out direct effects of some basic synchrotron design parameters and
associated subsystems (injector, X-ray beam line) on the operation and cost of lithography in production. The following
factors were considered: synchrotron configuration, injection energy, beam intensity variability, number of beam lines and
wafer exposure concept. A cost model has been worked out and applied to three different X-ray Lithography Source (XLS)
systems. The results of these applications are compared and conclusions drawn.