Dr. Won D. Kim
Principal Engineer at ASML US Inc
SPIE Involvement:
Author
Publications (16)

Proceedings Article | 10 April 2013
Proc. SPIE. 8681, Metrology, Inspection, and Process Control for Microlithography XXVII
KEYWORDS: Semiconducting wafers, Critical dimension metrology, Scatterometry, Metrology, Photomasks, Etching, Scatter measurement, Scanning electron microscopy, Lithography, Semiconductors

Proceedings Article | 4 April 2012
Proc. SPIE. 8324, Metrology, Inspection, and Process Control for Microlithography XXVI
KEYWORDS: Optical alignment, Semiconducting wafers, Overlay metrology, Scanners, Manufacturing, Control systems, Semiconductor manufacturing, Data modeling, Process control, Metrology

Proceedings Article | 2 April 2011
Proc. SPIE. 7985, 27th European Mask and Lithography Conference
KEYWORDS: Scanners, Semiconducting wafers, Calibration, Critical dimension metrology, Metrology, Optimization (mathematics), Printing, Data modeling, Photomasks, Model-based design

Proceedings Article | 4 November 2005
Proc. SPIE. 5992, 25th Annual BACUS Symposium on Photomask Technology
KEYWORDS: Inspection, Photomasks, Contamination, Reticles, Semiconducting wafers, SRAF, Manufacturing, Resolution enhancement technologies, Lithography, Sensors

Proceedings Article | 12 May 2005
Proc. SPIE. 5754, Optical Microlithography XVIII
KEYWORDS: SRAF, Critical dimension metrology, Optical proximity correction, Photomasks, Scanners, Lithographic illumination, Semiconducting wafers, Phase shifts, Lithography, Resolution enhancement technologies

Proceedings Article | 10 May 2005
Proc. SPIE. 5752, Metrology, Inspection, and Process Control for Microlithography XIX
KEYWORDS: Semiconducting wafers, Critical dimension metrology, Process control, Metrology, Inspection, Data modeling, Reflectometry, Spectroscopy, Optical lithography, Lithography

Showing 5 of 16 publications
SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Advertisement
Advertisement
Back to Top