An automatic flatness detection system for micro rings is developed. It is made up of machine vision module, ring supporting module and control system. An industry CCD camera with the resolution of 1628×1236 pixel, a telecentric with magnification of two, and light sources are used to collect the vision information. A rotary stage with a polished silicon wafer is used to support the ring. The silicon wafer provides a mirror image and doubles the gap caused by unevenness of the ring. The control system comprise an industry computer and software written in LabVIEW Get Kernel and Convolute Function are selected to reduce noise and distortion, Laplacian Operator is used to sharp the image, and IMAQ Threshold function is used to separate the target object from the background. Based on this software, system repeating precision is 2.19 μm, less than one pixel. The designed detection system can easily identify the ring warpage larger than 5 μm, and if the warpage is less than 25 μm, it can be used in ring assembly and satisfied the final positionary and perpendicularity error requirement of the component.
In the paper, a precision press-fit instrument for assembling small interference fitting parts is introduced, which includes pressing module and parts alignment module. The pressing module was used to clamp and position parts, and parts alignment module was used for the two parts’ alignment. Through analyzing press-fit control method, component alignment and adjustment strategy, and machine vision device calibration method, the instrument meets the pressing requirements of precision small components. Finite element method is used to predict the reasonable range of press-fit force, and pressing result of the instrument is tested by experiments.
Adhesive bonding is a popular assembly method for miniaturized component composed of parts with different materials. However, it also inevitably introduces assembly stresses in some stress-sensitive structures, which adversely influence the accuracy of the performance, as well as the long-term stability of the component. An on chip piezoresistive micro stress test circuit was designed and tested in this paper. Piezoresistors were fabricated by doping Boron to n-type silicon wafer. The sensitive structure on the micro part was a flexible beam which had a thickness of 50 μm. Silver epoxy adhesive and double epoxy adhesive were used in the assembly process and the stresses parallel and perpendicular to the flexible beam were calculated. The experimental results showed that silver epoxy adhesive introduced larger stress because the difference in thermal expansion coefficients between silver epoxy adhesive and silicon are larger than that of double epoxy adhesive. Aging tests were also carried out and 46 percent of stress on average was released in 100 days at room temperature. This preliminary work implied that the stress distribution of the sensitive structure at all stages of the assembly could be measured using on chip micro stress test circuit.
In the process of miniature parts’ assembly, the structural features on the bottom or side of the parts often need to be aligned and positioned. The general assembly equipment integrated with one vertical downward machine vision system cannot satisfy the requirement. A precision automatic assembly equipment was developed with double machine vision systems integrated. In the system, a horizontal vision system is employed to measure the position of the feature structure at the parts’ side view, which cannot be seen with the vertical one. The position measured by horizontal camera is converted to the vertical vision system with the calibration information. By careful calibration, the parts’ alignment and positioning in the assembly process can be guaranteed. The developed assembly equipment has the characteristics of easy implementation, modularization and high cost performance. The handling of the miniature parts and assembly procedure were briefly introduced. The calibration procedure was given and the assembly error was analyzed for compensation.
In assembly of miniature devices, the position and orientation of the parts to be assembled should be guaranteed during or after assembly. In some cases, the relative position or orientation errors among the parts can not be measured from only one direction using visual method, because of visual occlusion or for the features of parts located in a three-dimensional way. An automatic assembly system for precise miniature devices is introduced. In the modular assembly system, two machine vision systems were employed for measurement of the three-dimensionally distributed assembly errors. High resolution CCD cameras and high position repeatability precision stages were integrated to realize high precision measurement in large work space. The two cameras worked in collaboration in measurement procedure to eliminate the influence of movement errors of the rotational or translational stages. A set of templates were designed for calibration of the vision systems and evaluation of the system’s measurement accuracy.