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Xiaolei Zhang
Student at Changchun Univ of Science and Technology
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Publications (1)
SPIE Journal Paper | 24 August 2017
Analysis of thermal characteristics based on a new type diode laser packaging structure
OE, Vol. 56, Issue 08, 085105, (August 2017) https://doi.org/10.1117/12.10.1117/1.OE.56.8.085105
KEYWORDS: Packaging, Semiconductor lasers, High power lasers, Resistance, Thermal effects, Heat flux, Optical simulations, Laser welding, Aluminum nitride, Laser damage threshold
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